B4C powder compacts were sintered using a graphite dilatometer in flowing He under constant heating rates. Densification started at 1800°C. The rate of densification increased rapidly in the range 1870°–2010°C, which was attributed to direct B4C–B4C contact between particles permitted via volatilization of B2O3 particle coatings. Limited particle coarsening, attributed to the presence or evolution of the oxide coatings, occurred in the range 1870°–1950°C. In the temperature range 2010°–2140°C, densification continued at a slower rate while particles simultaneously coarsened by evaporation–condensation of B4C. Above 2140°C, rapid densification ensued, which was interpreted to be the result of the formation of a eutectic grain boundary liquid, or activated sintering facilitated by nonstoichiometric volatilization of B4C, leaving carbon behind. Rapid heating through temperature ranges in which coarsening occurred fostered increased densities. Carbon doping (3 wt%) in the form of phenolic resin resulted in more dense sintered compacts. Carbon reacted with B2O3 to form B4C and CO gas, thereby extracting the B2O3 coatings, permitting sintering to start at ∼1350°C.

This is a companion work to our previous study on the pressureless sintering of boron carbide (B 4 C). The Vickers hardness and indentation fracture toughness of B 4 C compacts were measured after various sintering heat treatments. Increases in hardness and decreases in indentation fracture toughness as the grain size decreased in sintered B 4 C were attributed to the effects of more rapid strain hardening associated with dislocation pileups at grain boundaries.

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This study presents a basic step toward the selection methodology of electric contact materials for microelectromechanical systems (MEMS) metal contact switches. This involves the interrelationship between two important parameters, resistivity and hardness, since they provide the guidelines and assessment of contact resistance, wear, deformation and adhesion characteristics of MEMS switches. For this purpose, thin film alloys of three noble metals, platinum (Pt), rhodium (Rh) and ruthenium (Ru) with gold (Au), were investigated. The interrelationship between resistivity and hardness was established for three levels of alloying of these metals with gold. Thin films of gold (Au), platinum (Pt), ruthenium (Rh) and rhodium (Ru) were also characterized to obtain their baseline data for comparison. All films were deposited on silicon substrates. When Ru, Rh and Pt are alloyed with Au, their hardness generally decreases but resistivity increases. This decrease or increase was, in general, dependent upon the amount of alloying.