This paper proposes an approach that resolves the tradeoff between bond pad crack, the passivation crack, and lead lift failure modes in gold-to-gold inner lead bonding. The bonding head temperature, stage temperature, and bonding force are addressed as three critical recipes. The proposed scenario determines the bonding head temperature according to the maximum compensation flatness, followed by the corresponding stage temperature and required bonding force in sequence. The relevant gold bump hardness, chip warpage, and flatness variation in the bonding tool were evaluated using the finite-element method. The corresponding bonding force was determined using semianalytical equations with empirical factors. A gate driver IC with 280 I/O pins was adopted to conduct the experimental verification in the engineering pilot run. With the optimal recipes, the obtained results demonstrated success in diminishing these three failure modes. The feasibility of proposed approach was verified experimentally.Index Terms-Gold-to-gold, inner lead bonding.
This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming. The bonding force derivation was based on the essential relationship between the bonding force and sinking value from the referred literature. The remaining three parameter equations were derived using empirical accumulation. The experimental data were collected by conducting eight TCP product trial runs to validate the methodology. In addition, the user-interface software was programmed to be user friendly. The development cycle time can be condensed from the average number of hours to less than one hour, revealing a time saving improvement during practical applications. Good yield rates were obtained as well.Index Terms-Bonding recipe, inner lead bonding (ILB), tape carrier package (TCP).
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