A facile and effective approach by incorporating silica nanoparticles (SNPs) to fabricate high performance epoxy-based electronic packaging materials which are both thermally conductive and electrically insulating was presented. Because of the strong interaction between SNPs and silver nanowires (AgNWs), uniformly dispersed SNPsmodified epoxy was employed to promote the dispersion of AgNWs in epoxy matrix. Further, the enhanced modulus of epoxy matrix by the incorporation of SNPs effectively alleviates the modulus mismatch between stiff AgNWs and epoxy matrix. Compared with epoxy/AgNWs composites without SNPs, the resulting hybrid materials, that is, epoxy/SNP/AgNWs, showed distinct improvements in thermal conductivity without degrading their mechanical properties. Also, the SNPs were absorbed onto the surface of AgNWs forming an electrical insulation layer to disrupt the electron flows between adjacent AgNWs, hence retaining the electrical insulation of epoxy matrix. Finally, this new fabrication method is easily scalable owing to its simple procedure and use of commercial well-dispersed SNPs-modified epoxies.

When capillary flow occurs in a uniform porous medium, the depth of penetration is known to increase as the square root of time. However, we demonstrate in this study that the depth of penetration in multi-section porous layers with variation in width and height against the flow time is modified from this diffusive-like response, and liquids can pass through porous systems more readily in one direction than the other. We show here in a model and an experiment that the flow time for a negative gradient of cross-sectional widths is smaller than that for a positive gradient at the given total height of porous layers. The effect of width and height of local layers on capillary flow is quantitatively analyzed, and optimal parameters are obtained to facilitate the fastest flow.

No abstract