To clarify whether pattern waviness due to line-edge-roughness enhances wiggling, distortion of straight and wavy patterns was numerically analyzed by the three-dimensional (3D) elastic finite element method. Wiggling occurs only in wavy patterns but not in straight patterns at a stress or aspect ratio much lower than their buckling thresholds. More severe wiggling occurs when the wavelength of initial waviness approaches a value that is 3.3 times the pattern height. These phenomena were experimentally confirmed in the etching of amorphous carbon with a SiON mask. We consider that precise etching without wiggling is achieved by the elimination of the original line-edge roughness and the reduction in mechanical stress in an underlying film to which the pattern is transferred.
The effect of gas chemistry during etching of an amorphous carbon layer (ACL) on wiggling has been investigated, focusing especially on the changes in residual stress. Although the HBr gas addition reduces critical dimension loss, it enhances the surface stress and therefore increases wiggling. Attenuated total reflectance Fourier transform infrared spectroscopy revealed that the increase in surface stress was caused by hydrogenation of the ACL surface with hydrogen radicals. Three-dimensional (3D) nonlinear finite element method analysis confirmed that the increase in surface stress is large enough to cause the wiggling. These results also suggest that etching with hydrogen compound gases using an ACL mask has high potential to cause the wiggling.
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