Resistive random access memories can potentially open a niche area in memory technology applications by combining the advantages of the long endurance of dynamic random‐access memory and the long retention time of flash memories. Recently, resistive memory devices based on organo‐metal halide perovskite materials have demonstrated outstanding memory properties, such as a low‐voltage operation and a high ON/OFF ratio; such properties are essential requirements for low power consumption in developing practical memory devices. In this study, a nonhalide lead source is employed to deposit perovskite films via a simple single‐step spin‐coating method for fabricating unipolar resistive memory devices in a cross‐bar array architecture. These unipolar perovskite memory devices achieve a high ON/OFF ratio up to 108 with a relatively low operation voltage, a large endurance, and long retention times. The high‐yield device fabrication based on the solution‐process demonstrated here will be a step toward achieving low‐cost and high‐density practical perovskite memory devices.
memories, and organic field-effect transistors (OFETs), have various advantages including mechanical flexibility, low cost, solution-processed fabrication, and tunable material functionalities by molecular design compared with silicon-based materials. [1][2][3][4][5][6][7][8][9][10][11][12][13] However, the contact resistance problem arising between organic materials and metal electrodes has been one of the dominant obstacles for adopting organic semiconducting devices instead of silicon-based devices. Diverse attempts, for instance, self-assembled monolayer (SAM) treatment on metal electrodes, [14][15][16][17][18][19] inserting a charge injection layer between OSC and metals, [20][21][22][23][24][25][26][27] choice of metals for better injection properties, [28,29] adopting carbon-based conductor like graphene as electrodes, [30] have been introduced to improve carrier injection across typically a non-ohmic contact. Especially, considering large operation voltages required for OFETs, improving contact properties of organic/metal interface is an essential step for practical applications of OSCs.Contact doping is one of the most effective techniques to reduce contact resistance and has been widely employed in silicon-based devices and recently in OSCs to reduce the contact resistance. [31][32][33][34][35][36] In order to avoid undesirable OFF currents, it needs to be performed selectively, i.e., in localized regions at the source-drain contacts only and not in the channel region. The doped regions have been usually confined to the top surface of the OSC film by depositing a small amount of dopants on the top of the organic film by thermal evaporation. As a result, the position of the gate dielectrics was normally restricted to the top side of devices (i.e., FETs in a top-gate structure) in order to enhance the charge injection from metal electrodes to the accumulation layer formed on the top surface of the polymer. [31,32] Recently, the combination of poly(2,5-bis(3-tetradecylthiophen-2-yl)thieno[3,2-b]thiophene) (PBTTT) and 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F 4 -TCNQ) as host and dopant material, respectively, has produced a highly conducting polymer that has been studied as a candidate for a synthetic metal and high power-factor thermoelectric material. [37][38][39][40][41] Interestingly, this combination achieved an efficient bulk-doping of PBTTT by solid-state diffusion which implied that the F 4 -TCNQ Organic semiconductors (OSCs) have been widely studied due to their merits such as mechanical flexibility, solution processability, and large-area fabrication. However, OSC devices still have to overcome contact resistance issues for better performances. Because of the Schottky contact at the metal-OSC interfaces, a non-ideal transfer curve feature often appears in the low-drain voltage region. To improve the contact properties of OSCs, there have been several methods reported, including interface treatment by self-assembled monolayers and introducing charge injection layers. Here, a selectiv...
In organic device applications, a high contact resistance between metal electrodes and organic semiconductors prevents an efficient charge injection and extraction, which fundamentally limits the device performance. Recently, various contact doping methods have been reported as an effective way to resolve the contact resistance problem. However, the contact doping has not been explored extensively in organic field effect transistors (OFETs) due to dopant diffusion problem, which significantly degrades the device stability by damaging the ON/OFF switching performance. Here, the stability of a contact doping method is improved by incorporating "dopant-blockade molecules" in the poly(2,5-bis(3-hexadecylthiophen-2-yl)thieno[3,2-b]thiophene) (PBTTT) film in order to suppress the diffusion of the dopant molecules. By carefully selecting the dopant-blockade molecules for effectively blocking the dopant diffusion paths, the ON/OFF ratio of PBTTT OFETs can be maintained over 2 months. This work will maximize the potential of OFETs by employing the contact doping method as a promising route toward resolving the contact resistance problem.
Recently, there have been numerous studies on utilizing surface treatments or photosensitizing layers to improve photodetectors based on 2D materials. Meanwhile, avalanche breakdown phenomenon has provided an ultimate high-gain route toward photodetection in the form of single-photon detectors. Here, the authors report ultrasensitive avalanche phototransistors based on monolayer MoS 2 synthesized by chemical vapor deposition. A lower critical field for the electrical breakdown under illumination shows strong evidence for avalanche breakdown initiated by photogenerated carriers in MoS 2 channel. By utilizing the photo-initiated carrier multiplication, their avalanche photodetectors exhibit the maximum responsivity of ≈3.4 × 10 7 A W −1 and the detectivity of ≈4.3 × 10 16 Jones under a low dark current, which are a few orders of magnitudes higher than the highest values reported previously, despite the absence of any additional chemical treatments or photosensitizing layers. The realization of both the ultrahigh photoresponsivity and detectivity is attributed to the interplay between the carrier multiplication by avalanche breakdown and carrier injection across a Schottky barrier between the channel and metal electrodes. This work presents a simple and powerful method to enhance the performance of photodetectors based on carrier multiplication phenomena in 2D materials and provides the underlying physics of atomically thin avalanche photodetectors.
Organic resistive memory devices are one of the promising next-generation data storage technologies which can potentially enable low-cost printable and flexible memory devices. Despite a substantial development of the field, the mechanism of the resistive switching phenomenon in organic resistive memory devices has not been clearly understood. Here, the time-dependent current behavior of unipolar organic resistive memory devices under a constant voltage stress to investigate the turn-on process is studied. The turn-on process is discovered to occur probabilistically through a series of abrupt increases in the current, each of which can be associated with new conducting paths formation. The measured turn-on time values can be collectively described with the Weibull distribution which reveals the properties of the percolated conducting paths. Both the shape of the network and the current path formation rate are significantly affected by the stress voltage. A general probabilistic nature of the percolated conducting path formation during the turn-on process is demonstrated among unipolar memory devices made of various materials. The results of this study are also highly relevant for practical operations of the resistive memory devices since the guidelines for time-widths and magnitudes of voltage pulses required for writing and reading operation can be potentially set.
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