Abstract:In this paper, we examine the design of planar inductors and consider an expansion of the conductor to reduce its resistance. An increase in the number of turns increases the proximity effect, capacitive coupling, and skin effect. The resulting effect will translate into an increase in the area occupied by the inductor and a decrease in the inductors' performances. In order to solve such difficulties, an alternative approach is to design tapered inductors. For the same electrical and geometrical characteristics, a tapered inductor occupies a larger area than a standard inductor.Our approach consists of designing a new concept regarding tapered planar inductors that occupy the same surface and maintain the same electrical characteristics as the standard planar inductor regarding the following topologies: circular, hexagonal, and square. The results obtained show that impedance is more important in the case of the tapered inductor.Higher impedance implies smaller current and hence smaller parasitic effects of the capacitance series and proximity effect.
The main aim of this paper is to present the new design of an integrated planar spiral inductor with a new structure of an underpass to obtain a high inductance, high quality factor and minimum losses into winding and magnetic core. The performance of this structure dependent on the geometrical, electrical parameters and material properties. These parameters are calculated at 350 MHz and this is the high frequency used for MEMS applications. Furthermore, thermal analysis in inductor from finite difference method is described. The heat transfer model is based on heat conduction and heat convection. Moreover, the heat source is calculated by different losses. In addition, the simulation results from 3D finite element method using software also been presented in this paper. It is based on both the classical heat equation and certain condition limits. However, a new design of an underpass has been proposed where a via is fabricated with a circular layer. The input and output of the spiral are implanted in the same direction. In addition, the magnetic core is the solution to decrease the temperature. Finally, the results of the finite difference method are compared with simulation results from finite element method. The good agreement between the results is obtained. The proposed via and a core magnetic are responsible for enhancement the thermal behavior in integrated inductor. The result shows that the temperature of the air core inductor and magnetic core inductor could be 53 °C and 33 °C, respectively.
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