Silver nanoparticle paste (SNP) was demonstrated to be a promising candidate as an alternative material to conventional silver electro-plating. The sintered film of SNP in a reductive atmosphere showed excellent bonding strength equivalent to the value of the silver electro-plated surface in gold and copper wire bonding. The silver hybrid paste (SHP) composed of micro and nanoparticles has been newly developed. SHP with 40 μm thickness exhibited low volume resistivity after sintering. The sintered film showed good wire bondability.
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