Hydrogen (H2) is currently of strategic importance in the pursuit of a decarbonized, environmentally benign, sustainable global energy system; however, the explosive nature of H2 requires leakage monitoring to ensure safe application in industry. Therefore, H2 gas sensors with a high sensitivity and fast response across a wide concentration range are crucial yet technically challenging. In this work, we demonstrate a new type of MEMS differential thermopile gas sensor for the highly sensitive, rapid detection of trace H2 gas in air. Facilitated by a unique MIS fabrication technique, pairs of single-crystalline silicon thermopiles (i.e., sensing and reference thermopiles) are batch fabricated with high-density single-crystalline silicon thermocouples, yielding an outstanding temperature sensitivity at the sub-mK level. Such devices ensure the detection of miniscule temperature changes due to the catalytic reaction of H2 with a detection limit as low as ~1 ppm at an operating temperature of 120 °C. The MEMS differential thermopiles also exhibit a wide linear detection range (1 ppm-2%, more than four orders of magnitude) and fast response and recovery times of 1.9 s and 1.4 s, respectively, when detecting 0.1% H2 in air. Moreover, the sensors show good selectivity against common combustible gases and volatile organics, good repeatability, and long-term stability. The proposed MEMS thermopile H2 sensors hold promise for the trace detection and early warning of H2 leakage in a wide range of applications.
Ultra-responsive single-crystal silicon MEMS thermopiles for differential thermal analysis (DTA) are developed. Facilitated by a unique “microholes interetch and sealing (MIS)” technique, pairs of suspended thermopiles are batch fabricated in a differential form, with high-density (54 pairs) n-type/p-type single-crystal silicon thermocouples integrated within each thermopile (sample area ~0.045 mm2). The fabricated MEMS thermopile sensors exhibit outstanding power responsivity of 99.5 V/W and temperature responsivity of 27.8 mV/°C, which are more than 4 times higher than those reported for material thermal analysis. The high-responsivity MEMS DTA chips allow us to accurately measure the indium melting point at different heating rates of ~1–100 °C/s. We also perform DTA measurement of the dehydration process of CuSO4·5H2O and the crystals show three stages of losing water of crystallization before becoming anhydrous copper sulfate salt. Our high-performance, cost-effective MEMS sensing chips hold promise for rapid and accurate DTA characterization for a wide range of applications.
This paper presents an ultra-small absolute pressure sensor with a silicon-micromachined TSV backside interconnection for high-performance, high spatial resolution contact pressure sensing, including flexible-substrate applications. By exploiting silicon-micromachined TSVs that are compatibly fabricated with the pressure sensor, the sensing signals are emitted from the chip backside, thereby eliminating the fragile leads on the front-side. Such a design achieves a flat and fully passivated top surface to protect the sensor from mechanical damage, for reliable direct-contact pressure sensing. A single-crystal silicon beam–island structure is designed to reduce the deflection of the pressure-sensing diaphragm and improve output linearity. Using our group-developed microholes interetch and sealing (MIS) micromachining technique, we fabricated ultra-small piezoresistive pressure sensors with the chip size as small as 0.4 mm × 0.6 mm, in which the polysilicon-micromachined TSVs transfer the signal interconnection from the front-side to the backside of the wafer, and the sensor chips can be densely packaged on the flexible substrate via the TSVs. The ultra-small pressure sensor has high sensitivity of 0.84 mV/kPa under 3.3 V of supply voltage and low nonlinearity of ±0.09% full scale (FS) in the measurement range of 120 kPa. The proposed pressure sensors with backside-interconnection TSVs hold promise for tactile sensing applications, including flexible sensing of wearable wristwatches.
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