Some of the current assembly issues of fine pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) are considered in conjunction with two applicable bonding methods including thermal and laser bonding. Advantages and disadvantages of each material/process combination are identified. Their applicability is further investigated to identify a process most suitable to the fine pitch packages (less than 40 μm). Numerical results and subsequent testing results indicate that NCA/laser bonding process produces most reliable joint for the fine pitch packages.
A connecting rod is a crucial part for transmitting an explosive force to the crankshaft in the engine. Stress concentration in connecting rod due to the accumulation of the repeated load may initiate micro crack and result in a crucial break down of the component. Two approaches are adopted to obtain a robust design of connecting rod. Inner and outer array matrix based on combinations of control factors and noise factors are constructed for using Taguchi method. Calculated stress results for each element of matrix are plotted in the Goodman diagram. Robust design approach by Taguchi method reduces stress concentration occurred in small end fillet area of the default model. Variable stress approach using Goodman diagram also confirms a robust design by Taguchi method.
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