The two-pass thermal compression behavior of near-β Ti-55511 alloy was investigated. The first-pass restoration mechanisms changed from dynamic recrystallization (DRX) to dynamic recovery (DRV) as the first-pass deformation temperature increased from 700 °C to 850 °C. The occurrence of recrystallization reduced the dislocation density, resulting in a slower grain growth rate in the subsequent process. Because of the static recrystallization (SRX) and β grain growth, the β grain size increased and the morphology became less uniform during the subsequent β holding process, which also changed the restoration mechanism during second-pass compression. The level of continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) become weaker during second-pass deformation. The changes in the restoration mechanism and the microstructures slightly increased the peak stress during the second-pass deformation.
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