The applicability of glass chips with powder-blasted microchannels for electrophoretic separations was examined, and the performance was compared to microchannels etched with hydrogen fluoride (HF), using bicarbonate buffer and rhodamine B and fluorescein as model compounds. The measured electroosmotic mobilities in all chips were comparable, with values of ca. 7 x 10(-4) cm(2) V(-1)s(-1). The effect of electrical field strength and detection length on the separation efficiency was monitored. It was found that the main source of dispersion is of the Taylor-Aris type, which was discussed in relation to channel roughness differences. Although in powder-blasted channels with a separation length of 8.20 cm, 7-9 times lower plate numbers were obtained than in a HF-etched channel with similar dimensions, successful separation of five fluorescein isothiocyanate (FITC)-labeled amino acids was obtained on a powder-blasted chip within 80 s. Efficiencies of up to 360 000 plates/m were demonstrated on this chip, when a higher buffer concentration was used at a field strength of 664 V/cm. It can be concluded that powder-blasted microchannel chips, although they have a lower separation efficiency compared to HF-etched chips, perform well enough for many applications. Powder blasting can therefore be considered a low-cost and efficient alternative to HF etching, in particular because of the possibility to fabricate access holes through the glass with the same process.
Microscale functional materials permit advanced applications in optics and photonics. This work presents the additive manufacturing of three-dimensional structured phosphors emitting red, green, blue, and white. The development of 3D...
Effizienz und Steuerungsfähigkeit sonochemischer Reaktionen steigert der Einsatz von Siliciumoberflächen mit Vertiefungen, in die Gas in einer Weise eingebracht werden kann, dass es auf Ultraschallbehandlung hin als Mikroblasenstrom freigesetzt wird (siehe Bilder). Um die chemisch aktiven Mikroblasen zu erhalten, sind weit geringere Ultraschallintensitäten erforderlich als in entsprechenden üblichen Reaktoren.
Convex cylindrical silicon nanostructures, also referred to as silicon nanocones, find their value in many applications ranging from photovoltaics to nanofluidics, nanophotonics, and nanoelectronic applications. To fabricate silicon nanocones, both bottom-up and top-down methods can be used. The top-down method presented in this work relies on pre-shaping of silicon nanowires by ion beam etching followed by self-limited thermal oxidation. The combination of pre-shaping and oxidation obtains high-density, high aspect ratio, periodic, and vertically aligned sharp single-crystalline silicon nanocones at the wafer-scale. The homogeneity of the presented nanocones is unprecedented and may give rise to applications where numerical modeling and experiments are combined without assumptions about morphology of the nanocone. The silicon nanocones are organized in a square periodic lattice, with 250 nm pitch giving arrays containing 1.6 billion structures per square centimeter. The nanocone arrays were several mm2 in size and located centimeters apart across a 100-mm-diameter single-crystalline silicon (100) substrate. For single nanocones, tip radii of curvature < 3 nm were measured. The silicon nanocones were vertically aligned, baring a height variation of < 5 nm (< 1%) for seven adjacent nanocones, whereas the height inhomogeneity is < 80 nm (< 16%) across the full wafer scale. The height inhomogeneity can be explained by inhomogeneity present in the radii of the initial columnar polymer mask. The presented method might also be applicable to silicon micro- and nanowires derived through other top-down or bottom-up methods because of the combination of ion beam etching pre-shaping and thermal oxidation sharpening. Graphic abstract A novel method is presented where argon ion beam etching and thermal oxidation sharpening are combined to tailor a high-density single-crystalline silicon nanowire array into a vertically aligned single-crystalline silicon nanocones array with < 3 nm apex radius of curvature tips, at the wafer scale.
ABSTRAC T This paper presentsthe first cryogenic micromachined cooler that is suitableto cool from ambienttemperatureto 169 kelvin and below The cooler operateswith the vapor compression cycle. It consists of a silicon micromactined condenser, a flow restriction/eraporata and two miniature glass-tube counterflow heatexchangers, which are integratedwith the silicon components using a novel gluing techrique. The system was tested with ethyene gas from 20 to 1 bar, and prodces a cooling powr, of 200 mW at 169 K with a mass flow of 0.5 mg/s.
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