Metal 3D printing technology is a promising manufacturing method. The quality of the printed product can pass for mechanical application, if the anisotropy of the microstructure, imperfections, deformation, and residual stress of the printed sample could be lower than the appropriate level or if they are fully illuminated. Thermal stress is one of the significant reasons for deformation in the 3D printed samples. Thermal stresses are the direct consequence of the local temperature gradient. In this research, the effect of the temperature printer’s chamber (from room temperature to 900 C) was studied on thermal stress and subsequent total deformation in the printed sample. The printed sample is a six-layers-printed walk, which could be considered as a building block of other complex shapes and give us inside about deformation. The computational results show a meaningful reduction in thermal stress and deformation at the higher temperature of the printer’s chamber. The lower final deformation of the printed sample is an important subject, especially for samples with complex shapes.
Metal 3D printing technology is a promising manufacturing method, especially in the case of complex shapes. The quality of the printed product is still a challenging issue for mechanical applications. The anisotropy of the microstructure, imperfections, and residual stress are some of the issues that diminish the mechanical properties of the printed sample. The simulation could be used to investigate some technical details, and this research has tried to computationally study the metal 3D printing of austenitic stainless steel to address austenite microstructure and local yield strength. Two computational codes were developed in Visual basics 2015 to simulate the local heating/cooling curve and subsequent austenite microstructure. A stochastic computational code was developed to simulate austenite grain morphology based on calculated thermal history. Then Hall-Pitch equation was used to estimate the yield strength of the printed sample. These codes were used to simulate the effect of temperature of the printer’s chamber on microstructure and subsequent yield strength. The austenite grain topology is more columnar at a lower temperature. The percentage of the equiaxed zone will be increased at a higher chamber’s temperature. Almost a fully equiaxed austenite microstructure will be achieved at 800 C chamber’s temperature, but the last printed layer, which is columnar and can be removed by cutting then. The estimated local austenite grain size and the local yield strength in the equiaxed regions are in the range of 15 to 30 μm and 270 to 330 MPa at 800 C temperature of printer’s chamber, respectively.
The growth of solid particles during liquid phase sintering was modeled by the Cellular Automata method. The binary phase diagram and Fickian approach for the diffusion process were applied to simulate the chemical composition variation in liquid and solid phases during sintering. The Oswald-Ripening effect was considered during the dissolution of the solid phase in the liquid phase. It is used to define the probability of solid-phase dissolution by the liquid phase and develop the model to simulate the alloy with solid solubility. So, the microstructure could be modeled in the liquid phase sintering process.
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