Molecular dynamics simulation was employed to make the model o f crack propagation fo r single crystal y-TiAl alloy. The effects o f the angle between a microcrack and loading direction on crack propagation were studied through the analysis o f the atomic configurations and stress-strain curves in the paper. The results show that the time fo r the emission o f first dislocation and the yield stress value decrease with the angle. The crack propagation occurs by the submain crack mechanism, which becomes more obvious as the angle increases and the number o f stacking faults and stair-rod dislocations decreases. K e yw o rd s: m icrocrack, y-TiA l alloy, crack propagation, m olecular dynam ics.
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