Calculated stress distributions within materials sealed together across planar interfaces and having subsequently undergone differential dimensional change were compared with values measured in glass composite pairs sealed together at high temperature and slowly cooled. Where interdiffusion had occurred, dramatic departures from simple theory were observed both in the magnitude and in the sign of the corresponding stresses.
Stress distributions calculated for thin disks having a cylindrical inclusion were found to agree with those measured for glass specimens cooled to room temperature after they were sealed. Maximum circumferential stress in the sheath was independent of inclusion size, but the more rapid decrease of this stress with distance from the inclusion makes crack extension from the interface impossible for inclusions below a certain size. For larger inclusions, flaws above a critical size can be expected to grow and to terminate after a certain distance.
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