ABSTRACT:The fracture and yield strength of polyetherimide was evaluated over a temperature range of 23 to 140°C for materials with number-average (M n ) and weightaverage molecular weight (M w ) ranging from 15.6 to 22.8 and 36.6 to 52.3 kg/mol, respectively. The brittle-to-ductile transition temperature, where an equal probability exists that an impact will result in a brittle or ductile failure, was determined by evaluating the temperature at which fracture and yield strength are equal. The transition temperature decreased from 155 to 60°C with increasing molecular weight and provided a measure of relative ductility between material samples. As a case study, the practical impact strength of an injection-molded food service tray was determined at 20°C and correlated with fracture strength as a function of molecular weight.
The rapid development and adoption of digital technology is leading to an increase in demand for smaller, faster digital data devices and faster digital telecommunication networks. This trend requires increased network bandwidth to handle large amounts of data and seamless integration of network devices with compatible end-user devices. This need is being met by using fiber-optic and photonics technology, infra-red (IR) signals to transmit information, and is fundamental changing the communication industry, thereby creating a need for new polymeric materials.New ULTEM* polyetherimide (PEI) and EXTEM* thermoplastic polyimide (TPI) resins meet the material requirements for the optoelectronics industry. These resins have building blocks enabling IR light transmission without degrading signal quality. They can be injection-molded into thin, precision optical lenses and connectors. ULTEM* resins are been widely used in this industry as fiber-optic components in trans-receivers. EXTEM* resins are amenable to lead-free soldering (LFS), a greener industrial assembly process. While still being IR-transparent, EXTEM* resin is an ideal material for LFS capable substrates, connectors and lenses. An optical product portfolio has been developed and is being presented as a solution to the opto-electronics component industry and some of the successful applications therein.
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