Nanostructured shuriken-like monoclinic scheelite phase BiVO (mBiVO) with preferentially exposed {010} facets was synthesized by a solvothermal process in a glycerol (Gly)/water mixed solvent using ethylenediamine tetraacetic acid disodium (EDTA) as the structure-directing agent. EDTA competes with Gly to control the kind and concentration of reaction species in the system, and thereby the preferential growth of mBiVO nanocrystals along the {010} facets as well as formation of a shuriken-like morphology can take place at the same time. The formation mechanism of products with different microstructures is proposed. The optimized mBiVO photocatalyst obtained using 0.4 mmol EDTA exhibited highest photocatalytic activity for methylene blue (MB) degradation, which could be attributed to the highest exposure degree of the active {010} facets, as well as the shuriken-like nanostructure, which enhanced the separation of photogenerated electrons and holes.
coatings were prepared by deposition of Cu layer between two Ni-P layers. The Cu layer was deposited by metal displacement reaction between Cu 2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive E corr and decreased I corr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.Keywords: electroless plating, multilayer coatings, porosity, electrochemical tests, crystalline Cu layerWielowarstwowe powłoki Ni-P/Cu/Ni-P wytworzono metodą osadzania miedzi pomiędzy dwoma warstwami Ni-P. Warstwę Cu otrzymano dzięki reakcji wypierania metalu przez metal (dla miedzi i żelaza). Aby określić właściwości korozyjne jednowarstwowej powłoki Ni-P, dwuwarstwowej Ni-P/Cu oraz trójwarstwowej Ni-P/Cu/Ni-P przeprowadzono pomiary elektrochemiczne w 3,5% roztworze NaCl. Powłoki trójwarstwowe w porównaniu do jednowarstwowych wykazały się większą wartością E corr , przy malejącej wartości I corr . Wskazuje to na poprawę odporności na korozję. Krzywe polaryzacji dla powłok trójwarstwowych charakteryzują się występowaniem dwóch obszarów pasywacji. Poprawa odporności na korozję jest skutkiem nie tylko tzw. zjawiska blokowania porów w miedzi. Powłoka z Cu działała także jako warstwa protektorowa, modyfikując mechanizm korozji i poprawiając odporność korozyjną powłok.
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