Atmospheric dielectric barrier discharge (DBD) was attempted to improve the resistance of wheat seed to drought stress. Effects of DBD plasma on wheat seed germination, seedling growth, osmotic-adjustment products, lipid peroxidation, reactive oxygen species (ROS), antioxidant enzyme activity, abscisic acid, and drought resistant related genes expression under drought stress were investigated. The changes of the wheat seed coat before and after the DBD plasma treatment were explored. Experimental results showed that the DBD plasma treatment could alleviate the adverse effects of drought stress on wheat seed germination and seedling growth; the germination potential and germination rate increased by 27.2% and 27.6%, and the root length and shoot length of the wheat seedlings also increased. Proline and soluble sugar levels under drought stress were improved after the DBD plasma treatment, whereas the malondialdehyde content decreased. ROS contents under drought stress were reduced after the DBD plasma treatment, whereas the activities of superoxide dismutase, catalase, and peroxidase were promoted. DBD plasma treatment promoted abscisic acid generation in wheat seedlings, and it also regulated functional gene LEA1 and stimulated regulation genes SnRK2 and P5CS to resist drought stress. Etching effect and surface modification occurred on the seed coat after the DBD plasma treatment.
Strong complexation between heavy metals and organic complexing agents makes the heavy metals difficult to be removed by classical chemical precipitation. In this study, a novel decomplexation method was developed using discharge plasma oxidation, which was followed by alkaline precipitation to treat water containing heavy metal-organic complex, that is, Cu-ethylenediaminetetraacetic acid (Cu-EDTA). The decomplexation efficiency of Cu complex reached up to nearly 100% after 60 min's oxidation by discharge plasma, which was accompanied by 82.1% of total organic carbon removal and energy efficiency of 0.62 g kWh. Presence of free Cu favored Cu-EDTA decomplexation, whereas the presence of excessive EDTA depressed this process. Cu-EDTA decomplexation was mainly driven by the produced O, O, O, and •OH by discharge plasma. Cu-EDTA decomplexation process was characterized by UV-vis, ATR-FTIR, total organic carbon, and three-dimensional fluorescence diagnosis. The main intermediates including Cu-EDDA, Cu-IDA, Cu-NTA, small organic acids, NH, and NO were identified, accompanied by Cu releasing. The followed precipitation process removed 78.1% of Cu, and Cu-associated precipitates included CuCO, CuCO(OH), CuO, and Cu(OH). A possible pathway of Cu complex decomplexation and Cu removal in such a system was proposed.
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