The wear and friction behavior of ultralow wear polytetrafluoroethylene (PTFE)/α-alumina composites first described by Burris and Sawyer in 2006 has been heavily studied, but the mechanisms responsible for the 4 orders of magnitude improvement in wear over unfilled PTFE are still not fully understood. It has been shown that the formation of a polymeric transfer film is crucial to achieving ultralow wear on a metal countersurface. However, the detailed chemical mechanism of transfer film formation and its role in the exceptional wear performance has yet to be described. There has been much debate about the role of chemical interactions between the PTFE, the filler, and the metal countersurface, and some researchers have even concluded that chemical changes are not an important part of the ultralow wear mechanism in these materials. Here, a "stripe" test allowed detailed spectroscopic studies of PTFE/α-alumina transfer films in various stages of development, which led to a proposed mechanism which accounts for the creation of chemically distinct films formed on both surfaces of the wear couple. PTFE chains are broken during sliding and undergo a series of reactions to produce carboxylate chain ends, which have been shown to chelate to both the metal surface and to the surface of the alumina filler particles. These tribochemical reactions form a robust polymer-on-polymer system that protects the steel countersurface and is able to withstand hundreds of thousands of cycles of sliding with almost no wear of the polymer composite after the initial run-in period. The mechanical scission of carbon−carbon bonds in the backbone of PTFE under conditions of sliding contact is supported mathematically using the Hamaker model for van der Waals interactions between polymer fibrils and the countersurface. The necessity for ambient moisture and oxygen is explained, and model experiments using small molecules confirm the reactions in the proposed mechanism.

The development of new organic semiconductors with improved electrical performance and enhanced environmental stability is the focus of considerable research activity. This communication presents the design, synthesis, and device stability data for novel bis-5'-alkylthiophen-2'yl-2,6-anthracene organic semiconductors. When incorporated into thin-film field-effect transistors, mobilities as high as 0.5 cm2/Vs and on/off current ratios greater than 107 are observed. We have investigated device stability in terms of both shelf life and operating lifetime. Devices incorporating the reported semiconductors display an average field-effect mobility of 0.4 cm2/Vs for DHTAnt and an on/off current ratio of 106 even after 15 months of storage. Furthermore, there is no decrease in performance during continuous operation of the devices over several thousand cycles.

Microcontact printing (microCP) is an effective way to generate micrometer- or submicrometer-sized patterns on a variety of substrates. However, the fidelity of the final pattern depends critically on the coupled phenomena of stamp deformation, fluid transfer between surfaces, and the ability of the ink to self-assemble on the substrate. In particular, stamp deformation can produce undesirable effects that limit the practice and precision of microCP. Experimental observations and comparison with theoretical predictions are presented here for three of the most undesirable consequences of stamp deformation: (1) roof collapse of low aspect ratio recesses, (2) buckling of high aspect ratio plates, and (3) lateral sticking of high aspect ratio plates. Stamp behavior was observed visually with an inverted optical microscope while load-displacement data were collected during compression and retraction of stamps. Additionally, a "robotic stamper" was used to deliver ink patterns in precise locations on substrates. These monomolecular ink patterns were then observed in high contrast using the surface potential scanning mode of an atomic force microscope. Theoretical models based on continuum mechanics were used to accurately predict both physical deformation of the stamp and the resultant inking patterns. The close agreement between these models and the experimental data presented clearly demonstrates the essential considerations one must weigh when designing stamp geometry, material, and loading conditions for optimal pattern fidelity.