A primary concern in recent nanocomposite research is practical application. In this study, various kinds of epoxybased nanocomposites were made and their properties evaluated to determine their applicability as insulating materials for heavy electric apparatuses. Experimental results demonstrated that nano-fillers enhance insulation breakdown properties in nanocomposites. Moreover, nano-and micro-filler combinations were adopted as an approach toward practical application of nanocomposite insulating materials. These nano-and microfiller mixed composites had the same low thermal expansion as aluminum, and insulation breakdown properties superior to those of conventional insulating materials. Consequently, an aluminum conductor and a vacuum interrupter were molded by the nano-and micro-filler mixed composites for the first time in nanocomposite research.

Nitrosylruthenium complexes containing 2,2':6',2"-terpyridine (terpy) have been synthesized and characterized. The three alkoxo complexes trans-(NO, OCH3), cis-(Cl, OCH3)-[RuCl(OCH3)(NO)(terpy)]PF6 ([2]PF6), trans-(NO, OC2H5), cis-(Cl, OC2H5)-[RuCl(OC2H5)(NO)(terpy)]PF6 ([3]PF6), and [RuCl(OC3H7)(NO)(terpy)]PF6 ([4]PF6) were synthesized by reactions of trans-(Cl, Cl), cis-(NO, Cl)-[RuCl2(NO)(terpy)]PF6 ([1]PF6) with NaOCH3 in CH3OH, C2H5OH, and C3H7OH, respectively. Reactions of [3]PF6 with an acid such as hydrochloric acid and trifluoromethansulforic acid afford nitrosyl complexes in which the alkoxo ligand is substituted. The geometrical isomer of [1]PF6, trans-(NO, Cl), cis-(Cl, Cl)-[RuCl2(NO)(terpy)]PF6 ([5]PF6), was obtained by the reaction of [3]PF6 in a hydrochloric acid solution. Reaction of [3]PF6 with trifluoromethansulforic acid in CH3CN gave trans-(NO, Cl), cis-(CH3CN, Cl)-[RuCl(CH3CN)(NO)(terpy)]2+ ([6]2+) under refluxing conditions. The structures of [3]PF6, [4]PF6.CH3CN, [5]CF3SO3, and [6](PF6)2 were determined by X-ray crystallograpy.

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Bio-plastics are made from renewable biomass sources. We focus on lignin and develop epoxy resins containing lignin derivatives. We describe the preparation and application of epoxy resin containing lignin as a matrix. Soda-lignin (SLG) is obtained from black liquor in a soda pulp process. First, we use a lignin manufacturing process in which a methanol extraction method enabled reduction in the molecular and hydroxyl equivalent weights of lignin and removal of SiO 2 and cellulose. Second, we investigate the ratio of diglycidyl ether of bisphenol-A (DGEBA) and methanol extraction SLG (me-SLG). From the viewpoint of cross-linking density and dielectric properties, 100/84 phr in the DGEBA/me-SLG casting system is found to be preferable. Finally, we try to fabricate an insulating material made up of DGEBA/me-SLG for an aluminum-based printed circuit board, and it achieves standard values.Index Terms-Epoxy resin, lignin, printed circuit board.

Toshiba has developed solid insulated switchgear (SIS), which insulates the main circuit with epoxy composites. The solid insulating system is able not only to use no SF6, which is a kind of global warming gas, but also to supply compact equipment. In SIS, heat generated by the current loss in the conductors is dissipated through the epoxy composite. Therefore, development of high thermal conductive epoxy composites has been desired with respect to large current class SIS such as 2500 A. In this article, epoxy composite was filled with MgO having high thermal conductivity and SiO2 having low thermal expansion coefficient. The result of temperature rise analysis of 40.5 kV–2500 A SIS demonstrated that the high thermal conductive epoxy composite reduced rising temperature by approximately 10 K compared to conventional epoxy composite.

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