Equivalent test results across maintenance levels have long been an elusive target for both military and commercial users. The fundamental reason for this is that it has been impractical to deploy the same ATE forward at the operations level as well as in support locations and/or depots. Forward deployed ATE tends to be based on requirements for ruggedness, transportability and a small footprint. In addition, it is usually targeted to support a small number of weapon system components. The other extreme is depot or factory ATE, with requirements for support of more weapon system components, and tending to have wider overall capability and a larger footprint. Because of the diverse size and packaging issues associated with the different environments, invariably, different ATE backplanes and instrument packaging formats are selected for each environment. Use of different instruments at each of the maintenance levels may lead to Can-Not-Duplicates (CNDs) at the depot test for electronic components pulled out of service based on test results of forward-deployed ATE. The goal of having test equivalence (eliminating CNDs) at the various levels is referred to as "Vertical Testability".Previous attempts at achieving vertical testability have mainly relied on a software approach. The desire is that Test Programs developed/hosted on different ATE units will operate in the same manner and with the same test results. This has met with limited success in achieving vertical testability. A major roadblock to success is dealing with very low-level, fundamental characteristic differences of instruments beyond the normal functional definition. This paper proposes a hardware-based solution for achieving vertical testability. Technology can now support a versatile mezzanine approach that can target a multitude of system backplanes and architectures. DRS TEM and C&H Technologies are working together to finalize a design, that provides a multitude of common analog stimulus and measurement functions in a double-wide M-module format. This M-module Analog Versatile Instrument Series (MAVIS) is based on repackaging and enhancing a DRS TEM design. This approach allows for several target backplanes, including PXI, VXI and LXI, depending on the carrier selected. The MAVIS is therefore scalable in a range of ATE. The paper will outline the functional capabilities of the MAVIS and how it applies in a variety maintenance and test environments.
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