O presente trabalho objetiva realizar uma revisão crítica que busque esclarecer os mecanismos responsáveis pela degradação da união, assim como analisar as informações da literatura e propor medidas para a realização de restaurações mais duradouras. Apesar do avanço tecnológico que proporcionou o surgimento de resinas compostas mais estéticas e resistentes ao desgaste, esses materiais ainda apresentam problemas em relação à obtenção e preservação do selamento proporcionado pelo sistema adesivo. Revisando a literatura acerca dessa problemática, o ataque enzimático às fibras colágenas expostas, assim como a dissolução dos componentes do adesivo parecem explicar o mecanismo de degradação da adesão a longo prazo. Dessa maneira, mudanças no protocolo clínico como a aplicação de clorexidina ou EDTA têm sido propostas visando aumentar a estabilidade de união dente-restauração.
ObjectiveThe aim of this study was to evaluate, in vitro, the union stability of resin cements to the dental substract through microtensile bond strength (µTBS) analysis and scanning electron microscopy (SEM). G6 = 11.01 (A) and after 1 year: G1 = 9.75 (A), G2 = 11.73 (A); G3 = 20.10 (B); G5 = 6.80 (A); G6 = 21.09 (B). All G4 group presented pretest failures. Methods Fifty /Kuraray without pre-treatment and G6-Multilink Sprint/Ivoclar-Vivadent which were adhered to its respective indirect resin composite restoration, (G1-Clearfil AP-X/Kuraray; G2-Filtek Z350/3M ESPE; G3-Gradia Direct X™/GC; G4-Aelite™/ Bisco; G5-Clearfil AP-X/ Kuraray; G6-Tetric Ceram/ Ivoclar-Vivadent). The resin blocks were cemented and the sticks were obtained by tooth, with an area of adhesive interface of 0,8mm² (±0,2). Results The mean values, submitted to Mann-Whitney and Kruskal-Wallis tests (α = 5%) were in MPa after 24 hours: G1 = 9.66 (A), G2 = 13.37 (A); G3 = 15.89 (A); G5 = 4.18 (B); ConclusionDuring the one year period, with the exception of BisCem, the self-adhesive resin cements were a favorable alternative for the adhesive cementation, standing out among these, the G-Cem and Multilink Sprint.
In this paper, a pre-treatment process for electroless copper (Cu) deposition on the polished alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 surface treatment were explored. Our work was carried out by changing the roughness of Al2O3 through micro-etching (coarsening), nucleation its surface by a two-step method (sensitization and activation) and electroless Cu plating deposited using non-commercial solution having formaldehyde as reducer, alkaline pH and operating temperature of 30 ºC. Contact angle system (CA), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), mechanical profilometer (DekTak XT) atomic force microscopy (AFM) and analysis by Gwyddion v2.27 software were used to evaluate the wet treatment and the morphology of the electroless deposition (ED) of Cu on the Al2O3 surface. The results show that the surface treatment of purity polished Al2O3 with 0.1% of vitreous materials present into the substrate surface, presents a high performance in ED film at low temperature (30 ºC), during the Cu deposition, obtaining more compact and uniform film, with small grain size, uniform thickness, and a high purity Cu metallic deposit.
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