This paper discusses the critical requirements for high volume flip chip die bonding. Product functionality for devices such as handheld telephones, laptop computers, and other personal electronic items has dnven a trend towards compactness of design and improved packaging processes. The paper presents an overview of products and technologies utilizing flip chip packaging techniques today and in the future. It includes a discussion of the technical and cost drivers of flip chip packaging.Flip chip technology offers design and processing advantages. Design advantages include smaller device footprint, improved electrical performance, better thermal dissipation properties and lower cost due to better use of silicon real estate. Processing advantages include shorter assembly cycle times, fewer operations, and higher yields.A range of packages is available for flip chip packaging including FC-CSP, FC-BGA, HFC-BGA, and others. A comparison of these packages is presented including a comparison of I/O count and package size. The paper describes the advantages and applications for each of these package types. The methodology of flip chip die bonding is rooted in die bonding with some interesting modifications.
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