Since the origin of microstructural analysis in the mid-1800's, there has been a steady development of new materials to meet the needs of the moment. This progress has produced our growing understanding of materials and how to use them. Microstructural analysis has played a key role in this progress and continual improvements in specimen preparation techniques, equipment and products have kept pace.Microstructural analysis has been important in the development of materials used for aerospace, automotive, electronics, bio-technology, and materials used in the petroleum industry. With certain modifications, microstructural analysis also played a vital role in the development and monitoring of the complex processes used to manufacture solid state devices and printed circuit boards.Today ceramics, polymers and both metal and polymer matrix composites have become more commonplace and are challenging the traditional role of metal alloys in the materials market. Other applications include thermally sprayed coatings and other coating processes that are applied to less expensive conventional materials. Microstructural analysis is more important than ever because these complex and expensive materials cannot be produced successfully without control of the microstructure.As we enter the 21 st century, cost effective methods to achieve the results necessary that reveal the true microstructure in all types of materials are being developed. Silicon carbide abrasive media has been the standard method for coarse and fine grinding for many years and continues to be used today for specific grinding applications.[1] The latter part of the 20th century saw the introduction of diamond, both in a fixed mode and in a suspension, being used for the initial grinding step and an intermediate lapping step.[2] The diamond suspensions were deposited on composite surface which produced high material removal rates and a flat surface. These composite surfaces can be used for many specimens before being replaced. Magnetic attachment systems were introduced which provided ease of surface exchange. The proper abrasive surface had to be selected for a specific material so that excessive damage would not be encountered during the grinding or lapping process.A resin bonded diamond surface was developed which reduces the damage created during the grinding and lapping of many materials while maintaining the flatness and integrity of the overall microstructure. Images were captured which reveal the results achieved on various materials.
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