The analysis and study of materials science and technological factors in the creation of film converters are carried out, the requirements for materials, their properties, and the technology of forming the converter elements are determined. It is shown that taking into account material science and technological factors ensures that the parameters of the film transducer match the required ones, resistance to external infiuencing factors, obtaining films of the initial composition, and stability of the production technology. The choice of material parameters is made taking into account the operating modes and conditions, static and dynamic loads acting on the elements of the converter, the properties of the starting materials and film elements. When joining dissimilar materials, the coefficients of linear expansion are taken into account. In the process of creating film converters, the initial materials, structural elements are processed in various technological environments and, are subjected to thermal effects, the specified structures and parameters of the film converter are formed, and at the same time, the imperfections in the initial materials and converter elements are amplified, which directly or indirectly affect the output parameters of the film converter. In the manufacture of film elements of the transducer, the choice of the method for producing thin films is determined by the purpose of the film, the compatibility of the method with other technological operations of microelectronic technology. The reproducibility of the electrophysical properties of thin films takes place during their deposition with a controlled composition, which is essential for the production of films based on semiconductor compounds and for the formation of the sensitive elements of the transducer. The analysis and study of methods for obtaining films showed that the energy efficiency of the process of ion sputtering of materials and the production of thin films of a given composition, technological fiexibility, the ability to control the thickness of the films by changing the current value, the deposition time and the pressure at which it is carried out are the most optimal.
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