The increasing demand for satellite communications within an environment which is not unlimited in terms of spectrum and orbital slots, requires more and more advanced satellite missions incorporating several services in a complex multi-frequency band communication payload. However the conception of high RF power payloads is not without real technical challenges. This article investigates two challenging needs facing the satellite manufacturers which are the control of Passive Inter-Modulation products (PIM) and the design of high RF power components free of Multipaction effects.
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