International audienceAn air-filled substrate integrated waveguide (SIW) made of a multilayer printed circuit board process is proposed in this paper. It is of particular interest for millimeter-wave applications that generally require low cost and low-loss performance and excellent power-handling capability. This three-layered air-filled SIW allows for substantial loss reduction and power-handling capability enhancement. The top and bottom layers may make use of a low-cost standard substrate such as FR-4 on which baseband or digital circuits can be implemented so to obtain a very compact, high-performance, low-cost, and self-packaged millimeter-wave integrated system. Over Ka-band (U-band), it is shown that the air-filled SIW compared to its dielectric-filled counterparts based on Rogers substrates RT/Duroid 5880 and also 6002 reduces losses by a mean value of 0.068 dB/cm (0.098 dB/cm) and 0.104 dB/cm (0.152 dB/cm), increases average power-handling capability by 8 dB (6 dB) and 7.5 dB (5.7 dB), and quality factor by 2.7 (2.8) and 3.6 (3.8) times, respectively. The peak power-handling capability of the proposed structure is also studied. A wideband transition is presented to facilitate interconnects of the proposed air-filled SIW with dielectric-filled SIW. Design steps of this transition are detailed and its bandwidth limitation due to fabrication tolerances is theoretically examined and established. For validation purposes, a back-to-back transition operating over the Ka-band is fabricated. It achieves a return loss of better than 15 dB and an insertion loss of 0.6 ±0.2 dB ( 0.3 ±0.1 dB for the transition) from 27 to 40 GHz. Finally, two elementary circuits, namely, the T-junction and 90 ° hybrid coupler based on the air-filled SIW, are also demonstrated
International audiencePhase shifters based on double dielectric slab-loaded air-filled substrate-integrated waveguide (SIW) are proposed for high-performance applications at millimeter-wave frequencies. The three-layered air-filled SIW, made of a low-cost multilayer printed circuit board process, allows for substantial loss reduction and power handling capability enhancement compared with the conventional dielectric-filled counterpart. It is of particular interest for millimeter-wave applications that generally require low-loss transmission and high-density power handling. Its top and bottom layers may make use of a low-cost standard substrate, such as FR-4, on which baseband analog or digital circuits can be implemented so to obtain very compact, low cost, and self-packaged millimeter-wave integrated systems compared with the systems based on rectangular waveguide while achieving higher performance than the systems based on the conventional SIW. In this paper, it is demonstrated that transmission loss can be further improved at millimeter-wave frequencies with an additional polishing of the top and bottom conductor surfaces. Over Ka-band, an improvement of average 1.56 dB/m is experimentally demonstrated. Using the air-filled SIW fabrication process, dielectric slabs can be implemented along conductive via rows without any additional process. Based on the propagation properties of the obtained double dielectric slab-loaded air-filled SIW, phase shifters are proposed. To obtain a broadband response, an equal-length compensated phase shifter made of two air-filled SIW structures, offering a reverse varying propagation constant difference against frequency, is proposed and demonstrated at Ka-band. Finally, a single dielectric slab phase shifter is investigated for comparison and its bandwidth limitation is highlighted
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