Polyimides with a combination of properties including low solar absorptivity (α) in thin films, atomic oxygen (AO), and ultraviolet (UV) radiation resistance, solubility in organic solvents in the imide form, high glass transition (T g) temperatures, and high thermal stability have been prepared and characterized. The polymers were prepared by reacting a novel aromatic diamine, [2,4-bis(3-aminophenoxy)phenyl]diphenylphosphine oxide (2), with aromatic dianhydrides in a polar aprotic solvent. The diamine was prepared from commercially available starting materials in a two-step reaction in relatively high yield. Copoly(amide acid)s and copolyimides were prepared using 2 in combination with other commercially available aromatic diamines. The chemistry as well as physical and mechanical properties of the polymers and films will be discussed.

The ability to produce tough, cross-linked networks that can, if necessary, be rendered soluble by an external stimulus such as acid or heat is highly desirable for a number of applications. An acetal containing diacrylate, 2,2-di(acryloyloxy-1-ethoxy)propane (ADA) (1), was synthesized by transketalization with 2-hydroxyethyl acrylate. Its photopolymerization kinetics were measured by real-time FT-IR and its degradation in acidic organic solvents was evaluated. Additionally, a diacrylate cross-linker containing a thermally labile Diels-Alder (DA) linkage ( 2) was synthesized and its reversibility was evaluated using solid-state NMR spectroscopy. The DA cross-linker (2) and ADA (1) were evaluated for use in Step-and-Flash Imprint Lithography (S-FIL). Finally, a dimethacrylate cross-linker containing a thermally labile urethane-oxime linkage (10) was synthesized. Its copolymerization with methyl methacrylate and reversibility were evaluated by size exclusion chromatography (SEC) and 1 H NMR spectroscopy.

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