Gas-liquid processing in microreactors remains mostly restricted to the laboratory scale due to the complexity and expenditure needed for an adequate numbering-up with a uniform flow distribution. Here, the numbering-up is presented for multiphase (gas-liquid) flow in microreactor suitable for a production capacity of kg/h. Based on the barrier channels concept, the barrier-based micro/milli reactor (BMMR) is designed and fabricated to deliver flow non-uniformity of less than 10%. The BMMR consists of eight parallel channels all operated in the Taylor flow regime and with a liquid flow rate up to 150 mL/min. The quality of the flow distribution is reported by studying two aspects. The first aspect is the influence of different viscosities, surface tensions and flow rates. The second aspect is the influence of modularity by testing three different reaction channels type: (1) square channels fabricated in a stainless steel plate, (2) in a glass plate, and (3) circular channels (capillaries) made of stainless steel.Additionally, the BMMR is compared to that of a single channel regard the slug and bubble lengths and bubble generation frequency. The results pave the ground for bringing multiphase flow in microreactor one step closer for large scale production via numbering-up.

No abstract

No abstract

No abstract

No abstract

No abstract

Currently, it is still a great challenge to obtain copper-based high-efficient dropwise condensation heat transfer (CHT) interfaces via template-free electrodepositing technologies. Here, we report that the density of template-free electrodeposited copper nanocones can maximally reach 1.5 × 106/mm2 by the synergistic control of substrate surface roughness, poly­(ethylene glycol) (PEG) molecular weight, and PEG concentration. After thiol modification, the densely packed copper nanocone samples can present low-adhesive superhydrophobicity and condensate microdrop self-jumping function at ambient environment. Condensation heat and mass transfer characterizations show that the CHT coefficient of copper surfaces can maximally enhance 98% for 20 °C vapor and 51% for 40 °C vapor by in situ growth of superhydrophobic densely packed copper nanocones. Although the dropwise condensation mode can change from the jumping mode to the mixed jumping and sweeping mode and the shedding-off mode along with the increase of surface subcooling and vapor temperature, the CHT performance of the nanosample is still superior to that of the contrast flat hydrophobic surface during the whole testing range of surface subcooling. As vapor temperature increases to 80 °C, the CHT performance of the nanosample is inferior to that of the contrast sample. The CHT enhancement under low-temperature vapor should be ascribed to the enhancement of small-drop mass transfer ability caused by low-adhesive superhydrophobicity nature of nanosample surfaces. Their performance degradation mainly results from increased drop–drop drag force along with the increase of surface subcooling and vapor temperature. In sharp contrast, the CHT deterioration under high-temperature vapor should be ascribed to larger drop-surface adhesion and drop–drop drag force. The former is caused by vapor penetration, whereas the latter is caused by the dramatically increased nucleation density and growth rate of condensates. These findings would help design and develop copper-based high-efficiency condensation heat transfer interfaces.

Power consumption and communication distance have become crucial challenges for SIM card RFID (radio frequency identification) applications. The combination of long distance 2.45 GHz radio frequency (RF) technology and low power 2 kHz near distance communication is a workable scheme. In this paper, an ultra-low frequency 2 kHz near field communication (NFC) method suitable for SIM cards is proposed and verified in silicon. The low frequency transmission model based on electromagnetic induction is discussed. Different transmission modes are introduced and compared, which show that the baseband transmit mode has a better performance. The low-pass filter circuit and programmable gain amplifiers are applied for noise reduction and signal amplitude amplification. Digital-to-analog converters and comparators are used to judge the card approach and departure. A novel differential Manchester decoder is proposed to deal with the internal clock drift in range-controlled communication applications. The chip has been fully implemented in 0.18 µm complementary metal-oxide-semiconductor (CMOS) technology, with a 330 µA work current and a 45 µA idle current. The low frequency chip can be integrated into a radio frequency SIM card for near field RFID applications.