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High throughput; (D) Mold and releasing issue, hard to form deep channels Large scale channel array, 2D channel, 1D nanoslit Thin film deposition 30-200 Polysilicon, Silicon dioxide, Silicon nitride, polymer (A) simple process, low cost, fast; (D) Hard to form uniform channels large scale array, 2D channel, 1D nanoslit Hot embossing >50 PET, PC, PS, PMMA, etc. (A) Simple process, low cost; (D) Easy to deformation Large scale array, 2D channel, 1D nanoslit deformation of PDMS 100-800 PDMS (A) Simple process, low cost; (D) Low yield large scale array, V-shaped channel, 2D channel Stress release 20-800 PS, PDMS, Photoresist (A) Low cost, maskless, simple process; (D) Low resolution, Low yield large scale array, V-shaped channel, 1D nanoslit Molecular self-assembly 20-800 Ti, Silicon, Polymer, etc. (A) Low cost; (D) Complex process, Low yield 2D channel, 1D nanoslit

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