As the limits of Moore’s law are approached, three-dimensional integration appears as the key to advanced microelectronic systems. Die-to-wafer assembly appears to be an unavoidable step to reach full integration. While robotic methods experience difficulties to accommodate fabrication speed and alignment accuracy, self-assembly methods are promising due to their parallel aspect, which overcomes the main difficulties of current techniques. The aim of this work is the understanding of the mechanisms of self-alignment with an evaporating droplet technique. Stable and unstable modes are examined. Causes for misalignments of chips on wafers and their evolution are investigated with the help of the SURFACE EVOLVER numerical software. Precautions for suitable alignment are proposed.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.