Cracking of thick GaN films grown on sapphire is reexamined on the basis of a combination of microstructural observations of cracking and established mechanics of fracture of films. It is argued that cracking is motivated by tensile growth stresses once a critical thickness is reached. Subsequent growth on the cracked films occurs, perpetuating the cracked structure until the crack surfaces approach one another and touch. Continued film growth buries the crack. Once the crack faces touch, there are conditions under which it is energetically favorable for the cracks to close and heal. Crack healing can be kinetically limited. Whether the crack healing is complete within the growth time depends on several factors including, it is suggested, whether impurities have adsorbed to the surface during growth. Conditions under which cracks that have extended into the sapphire substrate during film growth can act as critical flaws for fracture of the substrate on cooling are also presented.
The use of a low-temperature layer of GaN formed by hydride vapor-phase epitaxy (HVPE) as a template to grow high-quality HVPE films is demonstrated. Using layers formed by reacting GaCl and NH3 at 550 °C and annealed at a growth temperature of 1050 °C, thick films of GaN can be grown by HVPE with fewer than 108 dislocations per cm2. Dislocation densities measured by high-resolution x-ray diffraction, atomic-force microscopy step termination density and plan-view transmission electron miscroscopy reveal that ∼23 μm films have dislocation densities of ∼6×107 cm−2. Obtaining high-quality single-crystal character films was found to be dependent on several factors, most importantly, the rate of temperature increase to growth temperature and the layer thickness.
The cracking of GaN films and the associated cracking of substrates are described. The geometry, structure, and evolution of fracture demonstrate that GaN films crack under tensile stress during growth and are subsequently overgrown and partially healed. The film cracks channel along the (1010) GaN planes and also extend a distance of ~5 μm into the sapphire substrate. These incipient cracks in the substrate form a set of initial flaws that leads to complete fracture through the sapphire during cooling for sufficiently thick films. Each stage of this cracking behavior is well described by a fracture mechanics model that delineates a series of critical thicknesses for the onset of cracking that are functions of the film and substrate stresses, thicknesses, and elastic properties. Similar cracking behavior is found to occur independently of the choice of substrate between sapphire and SiC and is traced to a tensile stress generation mechanism early in the growth process, such as that provided by island coalescence. Cracking is the dominant stress relief mechanism, as opposed to dislocation generation or diffusion, because of the island growth mode and because of optimized growth temperatures at or below the brittle-to-ductile transition. Lateral epitaxial overgrowth (LEO) of GaN is shown to minimize substrate fracture even though film cracking remains unaffected. This effect explained in terms of the limits placed on the initial extent of insipient substrate cracks due to the LEO geometry.
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