The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm2 and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm2. The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.
A method of measurement of the thermal performances of composite materials on the base of the porous aluminium oxide is described. The method takes into account the heat inhomogeneity, the material inhomogeneity and anisotropy as well as specimen’s surface radiation. Investigations of the thermophysics properties of the porous substrate fabricated with using of the electrochemical aluminium oxide technology vs. temperature and long staying in a climate chamber were fulfilled. The tests demonstrated that the climatic impact does not influence on the high thermophysics properties of the aluminium oxide material that have extremely high thermal conductivity ≤ 120 W/(m·K).
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