Often photovoltaic modules are constructed with materials that are sensitive to water. This is most often the case with thin film technologies, including perovskite cells, where the active layers are a few microns thick and can be sensitive to moisture, liquid water or both. When moisture or liquid water can ingress, a small amount of water can lead to corrosion and depending on the resulting reactions, a larger local detrimental effect is possible. To prevent moisture from contacting photovoltaic components, impermeable frontsheets and backsheets are used with a polyisobutylene (PIB)‐based edge seal material around the perimeter. Here, we evaluate the ability of a PIB‐based edge seal using a molecular sieve desiccant to keep moisture out for the expected module lifetime. Moisture ingress is evaluated using test coupons where the edge seal is placed between 2 pieces of glass, one of which has a metallic calcium film on it, and monitoring the moisture ingress distance as a function of time. We expose samples to different temperature and humidity conditions to create permeation models useful for extrapolation to field use. This extrapolation indicates that this PIB material is capable of keeping moisture out of a module for the desired lifetime.
As creep of polymeric materials is potentially a safety concern for photovoltaic modules, the potential for module creep has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. To investigate the possibility of creep, modules were constructed, using several thermoplastic encapsulant materials, into thin-film mock modules and deployed in Mesa, Arizona. The materials examined included poly(ethylene)-co-vinyl acetate (EVA, including formulations both cross-linked and with no curing agent), polyethylene/polyoctene copolymer (PO), poly(dimethylsiloxane) (PDMS), polyvinyl butyral (PVB), and thermoplastic polyurethane (TPU). The absence of creep in this experiment is attributable to several factors of which the most notable one was the unexpected cross-linking of an EVA formulation without a cross-linking agent. It was also found that some materials experienced both chain scission and crosslinking reactions, sometimes with a significant dependence on location within a module. The TPU and EVA samples were found to degrade with cross-linking reactions dominating over chain scission. In contrast, the PO materials degraded with chain scission dominating over cross-linking reactions. Although we found no significant indications that viscous creep is likely to occur in fielded modules capable of passing the qualification tests, we note that one should consider how a polymer degrades, chain scission or cross-linking, in assessing the suitability of a thermoplastic polymer in terrestrial photovoltaic applications.
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