RESUMEllEn este trabajo se presentan resultados de propiedades tales como resistencia a la compresion y fluidez en mortero. Adicionalmente, consistencia, tiempo de fraguado y viscosidad en pastas. Todas estas propiedades fueron evaluadas con la adiciOn de una puzolana artificial como es la ceniza de cascarilla de arroz (CCA), la cual es un sub producto agroindustrial de una arrocera colombiana. La CCA se obtuvo a partir de un proceso termico y de molienda.Palabras ClavEs: Ceniza de cascarilla de arroz (CCA), puzolana, Reologia. AbstractIn the present paper, the results of properties such as compression strength and fluidity in mortar; along with consistency, setting times and viscosity in pastes are shown. All these properties were tested with the addition of an artificial pozzolan like rice husk ash (RHA), which is an agro industrial by product of a Colombian rice processor. The RHA was obtained from a thermal and milling process.
The deposition of 0.005 cm of lead-tin solder is required in the fabrication of flip-chip integrated circuits. Conventional bell jar techniques for coating masked wafers 214-in. (5.7-cm) diam severely limited the batch size. Consequently, a 142-position, 5-tier “ferris wheel” dome, rotated at 5 rpm, was used. A low-voltage radiation heated source was mounted within the dome and was masked experimentally to attain uniform deposition rates on each tier. The vacuum system for this arrangement is fairly novel for the semiconductor industry. Instead of the conventional bell jar a box coater, about 36-in. (0.9-m) on a side, with a full opening front door is used. This provides for extremely flexible design and easy operation. Specifically the “shoe horn” tooling so characteristic of bell jars is avoided. The lead-tin evaporation source is extremely rugged and reliable even though it evaporates 3 lb at a time. Thickness is within the range of 0.0046–0.006 cm and maintenance is minimal.
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