The selective metallisation of textiles is becoming a very important process in the development of electronic or e-textiles. This study investigated the efficacy of polymer coatings for the protection of copper (Cu) conductive tracks electroless plated on polyester (PES) fabric against laundering and rubbing, without essentially affecting the physical-mechanical and optical properties of the base material. After the electroless deposition of a consistent layer of Cu onto PES, four polymers were applied individually by screen-printing or padding. The physical-mechanical characterisation of coated textiles revealed that polyurethane resin (PUR) and modified acrylate resin (AR) had little effect on the air permeability, tensile strength and breaking tenacity of the PES, as compared to silicone elastomer polydimethylsiloxane (PDMS) and epoxy resin (ER). On the other hand, PUR and PDMS had higher abrasion resistance and photo-stability under prolonged UV irradiation, as compared to AR and ER. In addition, freshly Cu plated samples were coated with polymers, washed up to 30 cycles and characterised by measuring their electrical resistivity, determination of colour changes and the examination of the surface morphology. Based on these results, PUR presented the most suitable protection of Cu tracks on PES, with the lowest impact on physical-mechanical properties. ER is not recommended to be used for protection of Cu tracks on fabrics, due to its rigidity, low photo-stability, washing and wear durability.
A model is solved based on the Nernst Planck equation to calculate the diffusion and migration currents for a species in a thin layer (about 200 nm) confined between two electrodes. This is proposed to account for the current voltage behaviour of a memristor constructed in a similar fashion. At the working electrode, an electroactive species is oxidised and at the counter electrode, the same species is reduced. Upon application of a simple voltammetric waveform, the migration current exhibits a resistance profile at slow scan rates and hysteresis at faster scan rates, indicative of memristor behaviour.
The existing capability and current development needs for implementing electroforming as a viable manufacturing process to produce copper cylinders with dimensions comparable to the Swedish KBS-3 design are discussed. Large freestanding copper cylinders can be produced readily, but there is a need to address challenges associated with controlling the electro-deposition process to conform to compositional and mechanical requirements of the copper layers produced. The methodology to optimize the manufacturing process, based on a study of key parameters, such as the effects of electrolyte additives on grain size and the chemical composition of electroformed layers, is described here. Possible ways to introduce a robust manufacturing route are also presented.
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