Adequate characterization and quality control of atomically thin layered materials (2DM) has become a serious challenge particularly given the rapid advancements in their large area manufacturing and numerous emerging industrial applications with different substrate requirements. Here, we focus on ellipsometric contrast micrography (ECM), a fast intensity mode within spectroscopic imaging ellipsometry, and show that it can be effectively used for noncontact, large area characterization of 2DM to map coverage, layer number, defects and contamination. We demonstrate atomic layer resolved, quantitative mapping of chemical vapor deposited graphene layers on Si/SiO-wafers, but also on rough Cu catalyst foils, highlighting that ECM is applicable to all application relevant substrates. We discuss the optimization of ECM parameters for high throughput characterization. While the lateral resolution can be less than 1 μm, we particularly explore fast scanning and demonstrate imaging of a 4″ graphene wafer in 47 min at 10 μm lateral resolution, i.e., an imaging speed of 1.7 cm/min. Furthermore, we show ECM of monolayer hexagonal BN (h-BN) and of h-BN/graphene bilayers, highlighting that ECM is applicable to a wide range of 2D layered structures that have previously been very challenging to characterize and thereby fills an important gap in 2DM metrology.

In this Letter, we report on the near-surface modification of fused silica by applying a hydrogenous atmospheric pressure plasma jet at ambient temperature. A significant decrease in UV-transmission due to this plasma treatment was observed. By the use of secondary ion mass spectroscopy, the composition of the plasma-modified glass surface was investigated. It was found that the plasma treatment led to a reduction of a 100 nm thick SiO2 layer to SiOx of gradual depth-dependent composition. For this plasma-induced layer, depth-resolved characteristic optical parameters, such as index of refraction and dispersion, were determined. Further, a significant plasma-induced increase of the concentration of hydrogen in the bulk material was measured. The decrease in transmission is explained by the plasma-induced near-surface formation of SiOx on the one hand and the diffusion of hydrogen into the bulk material on the other hand.

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In this publication, it is shown how to synthesize silver nanoparticles from silver cations out of aqueous solutions by the use of an atmospheric pressure plasma source. The use of an atmospheric pressure plasma leads to a very fast reduction of silver ions in extensive solvent volumes. In order to investigate the nanoparticle synthesis process, ultraviolet/visible (UV/VIS) absorption spectra were recorded in situ. By using transmission electron microscopy and by the analysis of UV/VIS spectra, the kinetics of silver nanoparticle formation by plasma influence can be seen in more detail. For example, there are two different sections visible in the synthesis during the plasma exposure process. The first section of the synthesis is characterized by a linear formation of small spherical particles of nearly constant size. The second section is predominated by saturation effects. Here, particle faults are increasingly formed, induced by changes in the particle shape and the fusion of those particles. The plasma exposure time, therefore, determines the shape and size distribution of the nanoparticles.

In this Letter we present a novel approach for increasing the nanosecond laser-induced damage threshold (LIDT) of sapphire windows. It is shown that after direct dielectric barrier discharge plasma treatment at atmospheric pressure for 90 s the LIDT is increased by a factor of 1.5 with respect to untreated samples. Several possible underlying mechanisms are introduced. For instance, organic contaminants and residues from polishing agents were removed by the plasma as ascertained by XPS measurements.

The impact of stoichiometry and hydrogen content on the ArF excimer laser ablation characteristics of fused silica is investigated. Nearsurface substoichiometic SiOx with x < 2 diminishes the ablation threshold as a result of increased absorption. The ablation rate is raised by an elevated hydrogen content. As confirmed by mass spectrometric analysis, the laser-induced formation of substoichiometric near-surface layers within the ablation spot sustains absorption and ablation for consecutive laser pulses

We report on investigations of the spatial variations of contamination, roughness, and index of refraction of classically manufactured polished fused silica surfaces. Therefore, laser-induced breakdown spectroscopy was used to probe surface and subsurface impurities via the detection of aluminum. Measurements at different positions on the surface of the cylindrical fused silica windows evidenced an almost contamination-free center region, whereas a relatively large contamination area was found close to the edge. In-depth measurements verify the presence of aluminum atoms in the bulk until a depth of several tens of microns for the edge region. In addition, atomic force microscopic measurements show that the surface roughness is larger in the center region compared to the edge. Further, the index of refraction increases from the center region towards the edge as measured via ellipsometry. The results indicate a nonuniform impact of the grinding, lapping, and polishing tools on the surface. The findings turn out to be of specific interest for different applications, particularly for the realization of large-scale high-performance coatings.

In this contribution, we report on the impact of direct dielectric barrier discharge argon plasma at atmospheric pressure on femtosecond laser engraving of aluminium. It is shown that the assisting plasma strongly affects the surface geometry and formation of spikes of both laser-engraved single lines and patterns of adjacent lines with an appropriate overlap. Further, it was observed that the overall ablation depth is significantly increased in case of large-scale patterning whereas no notable differences in ablation depth are found for single lines. Several possible mechanisms and underlying effects of this behaviour are suggested. The increase in ablation depth is supposed to be due to a plasma-induced removal of debris particles from the cutting point via charging and oxidation as supported by EDX analysis of the re-solidified debris. Furthermore, the impact of a higher degree of surface wrinkling as well as direct interactions of plasma species with the aluminium surface on the ablation process are discussed.