The direct etching of polyethylene terephthalate film using a XeCl laser has been investigated and is shown to be consistent with a thermal model for degradation. Microstructure revealed by deep etching suggests the UV laser may prove useful for studying polymeric materials. Polyimide and photoresist film has also been directly etched.
An analytical model is presented, which allows estimating the expected dose rates resulting from X-ray emission from ultrashort-pulse laser-produced plasma under industrial conditions. The model is based on the calculation of the Bremsstrahlung spectrum in the X-ray region between about 5 keV and 50 keV, which is created by the hot electrons in the plasma. The model was calibrated with both spectral and dose rate measurements. The scaling of the hot-electron temperature and the fraction of hot electrons in the plasma served as calibration values. The agreement between experiments and model for the investigated irradiances in range from 10 12 to 10 15 W/cm 2 is excellent. The expected Ḣ (0.07) and Ḣ (10) dose rates at a distance of 20 cm from the process in air were calculated for upcoming lasers with 1 kW of average power. Although the dose rates close to the plasma significantly exceed the allowed dose of 50 mSv per year for an irradiance exceeding about 2·10 15 W/cm 2 , the calculations show that shielding with a 2-mm sheet of iron already at a distance of 20 cm attenuates the radiation to a safe value below 0.4 µSv/h.
Laser processing with ultra-short double pulses has gained attraction since the beginning of the 2000s. In the last decade, pulse bursts consisting of multiple pulses with a delay of several 10 ns and less found their way into the area of micromachining of metals, opening up completely new process regimes and allowing an increase in the structuring rates and surface quality of machined samples. Several physical effects such as shielding or re-deposition of material have led to a new understanding of the related machining strategies and processing regimes. Results of both experimental and numerical investigations are placed into context for different time scales during laser processing. This review is dedicated to the fundamental physical phenomena taking place during burst processing and their respective effects on machining results of metals in the ultra-short pulse regime for delays ranging from several 100 fs to several microseconds. Furthermore, technical applications based on these effects are reviewed.
A simplified analytical model is presented that predicts the depth progress during and the final hole depth obtained by laser percussion drilling in metals with ultrashort laser pulses. The model is based on the assumption that drilled microholes exhibit a conical shape and that the absorbed fluence linearly increases with the depth of the hole. The depth progress is calculated recursively based on the depth changes induced by the successive pulses. The experimental validation confirms the model and its assumptions for percussion drilling in stainless steel with picosecond pulses and different pulse energies.
We present a model to predict the final depth of percussion-drilled holes that are produced with picosecond laser pulses in metals. It is based on the assumption that boreholes always have conical geometries when the drilling process terminates. We show that the model is valid for various process parameters when drilling in stainless steel. This was even confirmed by drilling with 3 mJ pulses, which resulted in a 10 mm deep borehole without thermal damage.
The usage of pulse bursts allows increasing the throughput, which still represents a key factor for machining with ultra-short pulsed lasers. The influence of the number of pulses within a burst on the specific removal rate is investigated for copper and stainless steel. Furthermore, calorimetric measurements were performed to estimate the residual energy coefficient as well as the absorptance of machined surfaces for copper to explain the reduced specific removal rate for a 2-pulse burst and the similar or even higher rate for a 3-pulse burst compared to single pulse ablation. Based on the measurements, a description of the process using single pulses and pulse bursts with up to three pulses is presented.
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