This paper discusses the critical requirements for high volume flip chip die bonding. Product functionality for devices such as handheld telephones, laptop computers, and other personal electronic items has dnven a trend towards compactness of design and improved packaging processes. The paper presents an overview of products and technologies utilizing flip chip packaging techniques today and in the future. It includes a discussion of the technical and cost drivers of flip chip packaging.Flip chip technology offers design and processing advantages. Design advantages include smaller device footprint, improved electrical performance, better thermal dissipation properties and lower cost due to better use of silicon real estate. Processing advantages include shorter assembly cycle times, fewer operations, and higher yields.A range of packages is available for flip chip packaging including FC-CSP, FC-BGA, HFC-BGA, and others. A comparison of these packages is presented including a comparison of I/O count and package size. The paper describes the advantages and applications for each of these package types. The methodology of flip chip die bonding is rooted in die bonding with some interesting modifications.
The wind turbine industry is beginning to establish orthodoxies governing the repair of gearboxes, including policies governing the replacement of bearings during gearbox heavy maintenance events. Some maintainers recommend replacing all of the bearings, every time, regardless of condition or age. At the same time, others prefer to only replace the failed bearing. The former rationale achieves availability by spending more money than absolutely necessary; the latter sacrifices reliability in exchange for a lower shop visit cost. Even though neither approach results in the lowest Life Cycle Cost, no standard practice has yet been implemented to methodically determine what would be the best approach. Furthermore, as gearboxes approach the end of their planned service lives, a different strategy may be called-for. This paper presents an illustrative example of using a reliability-based statistical analysis to determine which strategy will yield the lowest Life Cycle Cost for wind turbine gearboxes.
Microwave modules and hybrid circuits have some unique requirements that demand extremely precise dispensing and placement, delicate handling and well controlled curing (or reflow). Assembly of these products can be challenging and defects may result in labor-intensive manual assembly methods. A better way is to apply automated manufacturing techniques to the assembly of microwave modules and hybrid circuits and thereby eliminate many of the variables that may narrow the process window.
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