Molecular junctions offer the opportunity for downscaling optoelectronic devices. Separating two electrodes with a single layer of molecules accesses the quantum-tunneling regime at low voltages (<1 V), where tunneling currents become highly sensitive to local nanometer-scale geometric features of the electrodes. These features generate asymmetries in the electrical response of the junction which combine with the incident oscillating optical fields to produce optical rectification and photocurrents. Maximizing photocurrents requires accurate control of the overall junction geometry and a large confined optical field in the optimal location. Plasmonic nanostructures such as metallic nanoparticles are prime candidates for this application, because their size and shape dictate a consistent junction geometry while strongly enhancing the optical field from incident light. Here we demonstrate a robust lithography-free molecular optoelectronic device geometry, where a metallic nanoparticle on a self-assembled molecular monolayer is sandwiched between planar bottom and semitransparent top electrodes, to create molecular junctions with reproducible morphology and electrical response. The well-defined geometry enables predictable and intense plasmonic localization, which we show creates optical-frequency voltages ∼ 30 mV in the molecular junction from 100 μW incident light, generating photocurrent by optical rectification (>10 μA/W) from only a few hundred molecules. Quantitative agreement is thus obtained between DC-and optical-frequency quantum-tunneling currents, predicted by a simple analytic equation. By measuring the degree of junction asymmetry for different molecular monolayers, we find that molecules with a large DC rectification ratio also boost zero-bias electrical asymmetry, making them good candidates for sensing and energy harvesting applications in combination with plasmonic nanomaterials.

Long-distance quantum communication and networking require quantum memory nodes with efficient optical interfaces and long memory times. We report the realization of an integrated two-qubit network node based on silicon-vacancy centers (SiVs) in diamond nanophotonic cavities. Our qubit register consists of the SiV electron spin acting as a communication qubit and the strongly coupled silicon-29 nuclear spin acting as a memory qubit with a quantum memory time exceeding 2 seconds. By using a highly strained SiV, we realize electron-photon entangling gates at temperatures up to 1.5 kelvin and nucleus-photon entangling gates up to 4.3 kelvin. We also demonstrate efficient error detection in nuclear spin–photon gates by using the electron spin as a flag qubit, making this platform a promising candidate for scalable quantum repeaters.

An efficient, scalable source of shaped single photons that can be directly integrated with optical fiber networks and quantum memories is at the heart of many protocols in quantum information science. We demonstrate a deterministic source of arbitrarily temporally shaped single-photon pulses with high efficiency [detection efficiency ¼ 14.9%] and purity [g ð2Þ ð0Þ ¼ 0.0168] and streams of up to 11 consecutively detected single photons using a silicon-vacancy center in a highly directional fiberintegrated diamond nanophotonic cavity. Combined with previously demonstrated spin-photon entangling gates, this system enables on-demand generation of streams of correlated photons such as cluster states and could be used as a resource for robust transmission and processing of quantum information.

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We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally measured Seebeck coefficient of our thermocouple was 9.17 × 10−4 V/°K, which is 30 times larger than those reported for standard metal thin-film thermocouples and comparable to the values of alloy-based thin-film thermocouples that require sophisticated and costly fabrication processes. The temperature-voltage measurements between 20 to 80 °C were highly linear with a linearity coefficient of 1, and the experimentally demonstrated temperature-sensing resolution was 0.01 °K which could be further improved up to a theoretical limit of 0.00055 °K. Finally, we applied this approach to demonstrate a flexible metal-on-silicon thermocouple with enhanced thermal sensitivity. The outstanding performance of our thermocouple combined with an extremely thin profile, bending flexibility, and simple, highly-compatible fabrication will proliferate its use in diverse applications such as micro-/nanoscale biometrics, energy management, and nanoscale thermography.