Abstract.A warmer climate may lead to less precipitation falling as snow in cold seasons. Such a switch in the state of precipitation not only alters temporal distribution of intra-annual runoff but also tends to yield less total annual runoff. Long-term water balance for 282 catchments across China is investigated, showing that a decreasing snow ratio reduces annual runoff for a given total precipitation. Within the Budyko framework, we develop an equation to quantify the relationship between snow ratio and annual runoff from a water-energy balance viewpoint. Based on the proposed equation, attribution of runoff change during the past several decades and possible runoff change induced by projected snow ratio change using climate experiment outputs archived in the Coupled Model Intercomparison Project Phase 5 (CMIP5) are analyzed. Results indicate that annual runoff in northwestern mountainous and northern highlatitude areas are sensitive to snow ratio change. The proposed model is applicable to other catchments easily and quantitatively for analyzing the effects of possible change in snow ratio on available water resources and evaluating the vulnerability of catchments to climate change.

silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2, 3] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

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