The effect of applying a rounded stylus to thin metallic films on glass substrates has been investigated using diamond and steel styli with tip radii of approximately 25 μm and loadings of up to 230 g. The films were vacuum-deposited indium, tin, lead, gold, copper, aluminium, nickel, chromium and molybdenum of various thicknesses up to 3·2 μm. Scanning electron microscope and optical interference microscope observations showed that the process of scratch formation was generally very complex and varied with the film material, indicating that it is not possible to deduce absolute values of adhesion forces using a simple general theoretical model. The method can, however, be used with caution for qualitative comparisons under certain restricted conditions.

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This paper reviews work to integrate Flowfihl® planarizing dielectric with Forcefihl® aluminum plug in a O.5/O.35im CMOS design. Work to reduce dielectric cracking by modifying the stress of the IMD material is described. The paper discusses liner choice for the Forcefill® interconnect and how it can influence lithography accuracy, line resistance and electromigration. The use of via chain resistance as a test to determine the degree of metal hole-fill is described.

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