Using the method of computer modelling, considered in this paper is optimization of a passive air system design for cooling the powerful LED luminaire based on heat pipes and cooling rings. Thermal and mass characteristics of the cooling system have been studied for various design parameters: distance between rings, thickness of ring materials and thermal loads. It has been shown that, to provide a minimal case temperature of LED source, the optimal distance between cooling rings should be 6 mm, but in this case the mass of cooling system is not least. To reduce the luminaire mass, it is reasonable to choose the distance between the cooling rings equal to 8 mm. Then the temperature of light source increases by only 1.8 °С, or by 2.2%, while the mass of cooling system reduces by 1357 g, or by 20.5%. At the same time, lowering the ring thickness from 2 down to 0.8 mm can in addition reduce this mass by 2700 g, or by 48.6%. However, when doing so the temperature of LED source case is increased by 5.9 °С. The offered cooling system based on heat pipes is capable to provide the thermal resistance 0.131 °С/W when scattering the thermal power 500 W under the maximum temperature of LED source crystal 135.5 °С. Recommendations for application of the developed cooling system have been formulated.
Conflict of Interest Declarations Electrica requires and encourages the authors and the individuals involved in the evaluation process of submitted manuscripts to disclose any existing or potential conflicts of interests, including financial, consultant, and institutional, that might lead to potential bias or a conflict of interest. Any financial grants or other support received for a submitted study from individuals or institutions should be disclosed to the Editorial Board. Cases of a potential conflict of interest of the editors, authors, or reviewers are resolved by the journal's Editorial Board within the scope of COPE guidelines.
LED light sources, and powerful multichip light sources in particular, are currently widely used for lighting household and industrial premises. With an increase in power, the amount of heat increases as well, which leads to an increase in the temperature of semiconductor crystals and, accordingly, to a decrease in the reliability of LEDs and a change in their photometric characteristics. Therefore, when developing the design of LED lighting devices, special attention is paid to thermal management. Since the early 2000s, heat pipes have been widely used to efficiently remove heat from powerful electronic components. They do not require power for moving the working fluid and are most suitable for use in LED luminaires.
In this study, the authors carry out a computer simulation of a cooling system based on heat pipes, which is then used to design and test a powerful compact LED lamp with a thermal load of up to 100 W.
Heat pipes with a length of 150 mm are used to remove heat from the LED light source to the heat exchanger rings located concentrically around it. The heat exchanger rings are cooled by natural convection of the ambient air. The results of computer modeling of the temperature field of the developed cooling system show that at a power of the LED light source of 140.7 W, the temperature of the LED matrix case is 60.5°C, and the experimentally measured temperature is 61.3°C. The experimentally determined thermal power of the LED matrix is 91.5 W. The p–n junction temperature is 79.6°C. The total thermal resistance of the cooling system is 0.453°C/W. The obtained results indicate the effectiveness of the developed design.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.