Abstract-The first, to our knowledge, passive, precision, selfalignment technique for direct coupling of vertical cavity surface emitting laser (VCSEL) and photodiode (PD) arrays to an array of polymer buried channel waveguides on a rigid printed circuit board (PCB) is reported. It gives insertion losses as good as the best achieved previously, to within experimental measurement accuracy, but without the need for costly active alignment nor waveguide facet polishing and so is a major step towards a commercially realizable low cost connector. Such an optical connector with four duplex channels each operating at 10 Gb/s (80 Gb/s aggregate) was designed, constructed, and its alignment precision assessed. The alignment technique is applicable to polymer waveguide interconnections on both rigid and flexible multilayer printed circuit boards (PCBs). The dependence of optical coupling loss on misalignments in , and of the VCSEL and PD arrays allows the precision of alignment to be assessed and its reproducibility on multiple mating cycles of the connector is reported. The first recorded measurements of crosstalk between waveguides when the connector is misaligned are reported. Lateral misalignments of the connector to within its tolerance are shown to have no effect on the signal to crosstalk ratio (SCR), to within experimental measurement accuracy. The insertion loss repeatability is similar to that of single mode fiber mechanically transferable (MT) connectors.

The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm 240 mm 4.3 mm electro-optical midplane. Bit error rates of less than and optical losses as low as 6 dB were demonstrated through nine multimode polymer waveguides with an aggregate data bandwidth of 92.8125 Gb/s.

Purpose -The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners. Design/methodology/approach -Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer-aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator. Findings -Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides. Several different laser systems can be used to form waveguide structures by ablation. Establishment of waveguide layout design rules from experimental measurements and modelling enables successful first time layout of complex interconnection patterns.Research limitations/implications -The complexity and length of the waveguides in a complex backplane interconnect, beyond that achieved in this paper, is limited by the bend loss and by the propagation loss partially caused by waveguide sidewall roughness, so further research in these areas would be beneficial to give a wider range of applicability. Originality/value -The paper gives an overview of advances in polymer formulation, fabrication methods and CAD tools, for manufacturing of complex hybrid-integrated OPCBs.

Structured AbstractPurpose -to introduce the Innovative Electronics Manufacturing Research Centre (IeMRC) Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing (OPCB), its objectives, its consortium of 3 Universities and 10 companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations, fabrication techniques, layout design rules and characterisation techniques for hybrid electronic and optical printed circuit boards using multimode polymer optical waveguide interconnects.Design/methodology/approach -We are investigating a number of different fabrication techniques which we compare with each other and with modelled calculations waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing.Findings -A number of design rules for polymer multimode waveguides have been found and published. Techniques for ink jetting polymer to print waveguides and laser ablation techniques have been developed. New formulations of polymer which cure faster for direct writing have also been developed. Research limitations/implications-Further work is needed to thicken the ink jet printed polymer and to investigate side wall roughness of the ablated waveguides and development of new polymer formulations for dry film. Further research is also needed on construction of prototype system demonstrators.Practical Implications -the fabrication techniques being developed are designed to be transferred to industrial PCB manufacturers to enable them to make higher value optical printed circuit boards. The design rules being discovered are being entered into commercial PCB layout software to aid designers of optical printed circuit boards.Originality/value -The paper is of interest to PCB manufacturers who wish to upgrade their processes to be able to manufacture optical printed circuit boards. The university research is original and some published to date in the publications in the reference list.

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