Malignant glioma is a fatal brain tumor whose pathological progression is closely associated with glycolytic reprogramming, leading to the high expression of monocarboxylate transporter 1 (MCT1) and its ancillary protein, cluster of differentiation 147 (CD147) for enhancing lactate efflux. In particular, malignant glioma cells (GMs) release tremendous number of exosomes, nanovesicles of 30 to 200 nm in size, promoting tumor progression by the transport of pro-oncogenic molecules to neighboring cells. In the present study, we found that hypoxia-induced malignant GMs strongly enhanced MCT1 and CD147 expression, playing a crucial role in promoting calcium-dependent exosome release. Furthermore, it was first identified that hypoxic GMs-derived exosomes contained significantly high levels of MCT1 and CD147, which could be quantitatively detected by noninvasive localized surface plasmon resonance and atomic force microscopy biosensors, demonstrating that they could be precise surrogate biomarkers for tracking parent GMs’ metabolic reprogramming and malignant progression as liquid biopsies.
Rare earth (RE) elements with concentrations of 0.05 wt.% and 0.1 wt.% of primarily Ce and La were added to the Sn-9Zn eutectic alloy to produce Sn-9Zn-RE alloys. A small amount of rodlike Zn-rich phases, which decreases in amount as the RE content increases, is distributed in the Sn matrix under slow cooling. The microstructure is refined with RE additions, and particulateshaped Sn-RE compounds begin to appear when the RE content reaches 0.1 wt.%. There is no change in the liquidus temperature after RE additions. Of the rosin-activated (RA), rosin mildly activated (RMA), rosin-nonactivated (R), and volatile organic compounds (VOC)-free types of fluxes used for the wetting balance tests in ambient air at 245°C, 260°C, and 290°C, only the RA flux can provide wetting. The addition of RE elements or the increase in soldering temperature reduces the wetting angle and increases the wetting force. The microhardness of the Sn-Zn-RE alloy system was found to be higher than that of Sn9Zn.
The Sn-0.7%Cu alloy has been considered as a lead-free alternative to lead-tin alloys. In this work, various small amounts of rare earth (RE) elements, which are mainly Ce and La, have been added to the Sn-0.7%Cu alloy to form new solder alloys. It was found that the new alloys exhibit mechanical properties superior to that of the Sn-0.7%Cu alloy. In particular, the addition of up to 0.5% of RE elements is found to refine the effective grain size and provide a fine and uniform distribution of Cu 6 Sn 5 in the solidified microstructure. Tensile, creep, and microhardness tests were conducted on the solder alloys. It was found that significant improvements of the tensile strength, microhardness, and creep resistance were obtained with RE element addition. Upon aging at 150°C for 20 h, the microstructure of Sn-Cu-RE is more stable than that of the Sn-Cu alloy.
To improve the properties of the eutectic Sn–Ag lead-free solder alloy, various amounts of mixed rare-earth (RE) elements, mainly Ce and La, were added. The microstructure, wetting properties, melting behavior, mechanical properties, and creep behavior were studied. It was revealed that RE elements can refine the intermetallics, and with 0.5% RE addition, the RE-bearing phase can be detected in the microstructure of the slow-cooled alloy. The results of differential scanning calorimetry indicate that the melting points of the RE-doped alloys are slightly lower than that of the Sn–3.5Ag and have a eutectic peak. The wetting property and creep resistance of the Sn–3.5Ag–0.25RE alloy are better than those of the Sn–3.5Ag alloy. The creep properties were studied at the temperatures of 303, 348, and 393 K, at various stress levels between 8 and 34 MPa. The stress exponents of the Sn–3.5Ag and Sn–3.5Ag–0.25RE were obtained at these temperatures. Tensile, creep, and wetting properties were found to improve with the addition of RE elements. The improvement of creep resistance is due to the fine dispersion of intermetallics and the decrease in interface energy between matrix and intermetallics. The wettability improvement is mainly due to the accumulation of RE elements at the solder/flux interface, leading to the reduction of the interfacial tension between solder and flux.
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