This present work evaluates the influence of microstructure on the fracture toughness of two types of silicon nitride. The two microstructural types of silicon nitride were processed using the gas pressure sintering (GPS) and hot pressing (HP) pathways. The fracture toughness was measured using the Single Edge V-Notch Beam (SEVNB) and Chevron Notch Beam (CNB) methods. The results from both methods for the two forms were in close agreement (with a maximum variation of 5.8%); the K Ic of the material processed by HP was 35% higher than that of GPS and the grain length had a direct influence on the fracture toughness

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