Four emitters based on the naphthyridine acceptor moiety and various donor units exhibiting thermally activated delayed fluorescence (TADF) were designed and synthesized. The emitters exhibited excellent TADF properties with a small ΔE ST and a high photoluminescence quantum yield. A green TADF organic light-emitting diode based on 10-(4-(1,8-naphthyridin-2-yl)phenyl)-10H-phenothiazine exhibited a maximum external quantum efficiency of 16.4% with Commission Internationale de L'ećlairage coordinates of (0.368, 0.569) as well as a high current and power efficiency of 58.6 cd/A and 57.1 lm/W, respectively. The supreme power efficiency is a recordhigh value among the reported values of devices with naphthyridine-based emitters. This results from its high photoluminescence quantum yield, efficient TADF, and horizontal molecular orientation. The molecular orientations of the films of the host and the host doped with the naphthyridine emitter were explored by angle-dependent photoluminescence and grazing-incidence small-angle X-ray scattering (GIWAXS). The orientation order parameters (Θ ADPL ) were found to be 0.37, 0.45, 0.62, and 0.74 for the naphthyridine dopants with dimethylacridan, carbazole, phenoxazine, and phenothiazine donor moieties, respectively. These results were also proven by GIWAXS measurement. The derivative of naphthyridine and phenothiazine was shown to be more flexible to align with the host and to show the favorable horizontal molecular orientation and crystalline domain size, benefiting the outcoupling efficiency and contributing to the device efficiency.
This paper presents a novel design flow for threedimensional (3D) heterogeneous system prototyping platform, namely, MorPACK (morphing package). The 3D-stacking technique makes the MorPACK platform with heterogeneous integration capabilities through connection modules and circuit modules. Based on system partition and tri-state interface connecting, the MorPACK system can be efficiently extended by system bus interfaces and can improve the functions by only updating the bare die/module. In addition, the total silicon prototyping cost of heterogeneous SoC projects can be greatly reduced by sharing the MorPACK common system platform. To demonstrate the effectiveness of the proposed platform, six SoC projects are implemented. The results show that there are 79.13% fabrication cost reduced by the MorPACK platform in TSMC 90nm CMOS. Besides, around 60% performance improvement of operation frequency can be benefited.Index Terms-3D Heterogeneous Integrated Platform, Mor-PACK, Platform-based Design I. INTRODUCTIONWith the fast advance of IC fabrication and electronic design automation (EDA) technologies, the system-on-a-chip (SoC) design technology has become more and more practical. A complex system can be integrated into a single chip through SoC design methodology and then achieves lower power consumption, lower cost, and higher speed than the traditional system on board design. Among the existing SoC design methodologies, the platform-based methodology [1] is the most off-the-shelf one. In this way, a platform is defined as an architectural framework consisting of a set of pre-qualified software and hardware IPs, which were integrated into some specific on-chip connection architecture.The platform-based design methodology is helpful for SoC implement. However, most of silicon areas expensed on the platform elements include processor, memory, bus, controller, or I/O. However, the user's IPs or special hardware accelerator designs of the projects/designs consume a few silicon areas. Therefore, in order to reduce the fabrication cost of SoC implement, an innovative Multi-Project System-on-a-Chip (MPSoC) design service model was developed. Although the MPSoC concept greatly reduces fabrication cost, however it is impractical to integrate the heterogeneous designs into a single system and the additional efforts of isolation mechanism need to be taken to prevent the interferences from other SoC projects in MP-SoC design. Besides, the efforts to integrate and implement the multi-projects into a single chip are relatively high.
PurposeTo build machine learning models for predicting the risk of in-hospital death in patients with sepsis within 48 h, using only dynamic changes in the patient's vital signs.MethodsThis retrospective observational cohort study enrolled septic patients from five emergency departments (ED) in Taiwan. We adopted seven variables, i.e., age, sex, systolic blood pressure, diastolic blood pressure, heart rate, respiratory rate, and body temperature.ResultsAmong all 353,253 visits, after excluding 159,607 visits (45%), the study group consisted of 193,646 ED visits. With a leading time of 6 h, the convolutional neural networks (CNNs), long short-term memory (LSTM), and random forest (RF) had accuracy rates of 0.905, 0.817, and 0.835, respectively, and the area under the receiver operating characteristic curve (AUC) was 0.840, 0.761, and 0.770, respectively. With a leading time of 48 h, the CNN, LSTM, and RF achieved accuracy rates of 0.828, 0759, and 0.805, respectively, and an AUC of 0.811, 0.734, and 0.776, respectively.ConclusionBy analyzing dynamic vital sign data, machine learning models can predict mortality in septic patients within 6 to 48 h of admission. The performance of the testing models is more accurate if the lead time is closer to the event.
Efficiency and operation lifetime of blue triplet‐triplet annihilation organic light emitting diodes (TTA‐OLEDs) were enhanced by 16% and 297%, respectively, by employing double emitting layer structure. Blue OLED with maximum external quantum efficiency of 9.4% and half‐lifetime of 96,620 hours at initial luminance of 1,000 cd/m2 was achieved.
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