Two series of fluorinated copolymerized polyimide films with different dianhydride ratios were prepared via the conventional two-step method by using 4,4-oxydianiline(ODA) as the diamine monomer, 4,4'-(hexafluoroisopropylidene) diphthalic anhydride(6FDA), 4,4'-oxydiphthalic anhydride(ODPA) and 3,3',4,4'-biphenyl tetracarboxylic dianhydride(BPDA) as the dianhydride monomer in N, N-dimethylacetamide. With the increase of 6FDA in the proportion of dianhydride, the tensile strength of the polyimide film showed a decreasing trend. This work provided a high performance film. The mass retention rate at 800°C was above 50%. The glass transition temperatures of the two films were 260 °C and 275 °C. The storage modulus of the two were 1500 MPa and 1250 MPa. The loss modulus were 218.70 MPa and 120.74 MPa. The transmittance of the film was 71.43%. The transmittance of fluorinated copolymerized polyimide films were significantly improved in the visible region of ultraviolet light, indicating that the polyimide film with high transmittance, high tensile strength, high heat resistance and high storage modulus was successfully prepared. It had an excellent application prospect in the field of flexible display.
Flexible transparent substrate materials, which was able to withstand high dynamic strain, in contrast to traditional substrate materials. A flexible and transparent material with advantages including transparency, stable size, and excellent corrosion and electrical resistance was provided. The polyimide(PI) film was prepared by introducing a structure with a high content of F atom and a fine optimization process to enhance the various properties of the film. However, the properties of the films were optimized effectively by gradient vacuum and secondary dissolution so that the film had a transmittance at 400 nm of 82%. The films with low dielectric constant and low dielectric loss represent the breakdown strength of 202 kV/mm. The glass transition temperature of the film was 267 °C, and the thermal expansion coefficient was 35ppm/k (30 °C~270 °C), indicated outstanding thermal dimensional stability. Therefore, this polyimide film was an optoelectronic device with extremely high application potential on the folding mobile phone and the PI film is the finest materials of screen.
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