In this study, we have successfully demonstrated that a GaN nanowire (GaNNW) based extended-gate field-effect-transistor (EGFET) biosensor is capable of specific DNA sequence identification under label-free in situ conditions. Our approach shows excellent integration of the wide bandgap semiconducting nature of GaN, surface-sensitivity of the NW-structure, and high transducing performance of the EGFET-design. The simple sensor-architecture, by direct assembly of as-synthesized GaNNWs with a commercial FET device, can achieve an ultrahigh detection limit below attomolar level concentrations: about 3 orders of magnitude higher in resolution than that of other FET-based DNA-sensors. Comparative in situ studies on mismatches ("hotspot" mutations related to human p53 tumor-suppressor gene) and complementary targets reveal excellent selectivity and specificity of the sensor, even in the presence of noncomplementary DNA strands, suggesting the potential pragmatic application in complex clinical samples. In comparison with GaN thin film, NW-based EGFET exhibits excellent performance with about 2 orders higher sensitivity, over a wide detection range, 10(-19)-10(-6) M, reaching about a 6-orders lower detection limit. Investigations illustrate the unique and distinguished feature of nanomaterials. Detailed studies indicate a positive effect of energy band alignment at the biomaterials-semiconductor hybrid interface influencing the effective capacitance and carrier-mobility of the system.

Silicon single-photon avalanche detectors are becoming increasingly significant in research and in practical applications due to their high signal-to-noise ratio, complementary metal oxide semiconductor compatibility, room temperature operation, and cost-effectiveness. However, there is a trade-off in current silicon single-photon avalanche detectors, especially in the near infrared regime. Thick-junction devices have decent photon detection efficiency but poor timing jitter, while thin-junction devices have good timing jitter but poor efficiency. Here, we demonstrate a light-trapping, thin-junction Si single-photon avalanche diode that breaks this trade-off, by diffracting the incident photons into the horizontal waveguide mode, thus significantly increasing the absorption length. The photon detection efficiency has a 2.5-fold improvement in the near infrared regime, while the timing jitter remains 25 ps. The result provides a practical and complementary metal oxide semiconductor compatible method to improve the performance of single-photon avalanche detectors, image sensor arrays, and silicon photomultipliers over a broad spectral range.

No abstract

In this paper, the integration of metal oxides as carrier-selective contacts for ultrathin crystalline silicon (c-Si) solar cells is demonstrated which results in an ∼13% relative improvement in efficiency. The improvement in efficiency originates from the suppression of the contact recombination current due to the band offset asymmetry of these oxides with Si. First, an ultrathin c-Si solar cell having a total thickness of 2 μm is shown to have >10% efficiency without any light-trapping scheme. This is achieved by the integration of nickel oxide (NiO) as a hole-selective contact interlayer material, which has a low valence band offset and high conduction band offset with Si. Second, we show a champion cell efficiency of 10.8% with the additional integration of titanium oxide (TiO), a well-known material for an electron-selective contact interlayer. Key parameters including V and J also show different degrees of enhancement if single (NiO only) or double (both NiO and TiO) carrier-selective contacts are integrated. The fabrication process for TiO and NiO layer integration is scalable and shows good compatibility with the device.

The full exploration of Si-based photonic integrated circuits is limited by the lack of an efficient light source that is compatible with the complementary metal− oxide−semiconductor process. Highly strained germanium (Ge) is a promising solution, as its band structure can be fundamentally altered by introducing tensile strain. However, the main challenge lies in the incorporation of an electrical structure while maintaining high strain with uniform distribution in the active region. Here we present highly strained Ge LEDs driven by lateral p−i−n junctions and report the strain-induced enhancement of electroluminescence (EL) from Ge. Raman characterization shows that 1.76% strain along the ⟨100⟩ direction with relatively uniform strain distribution is achieved. The observed strain-induced red-shifts of EL spectra agree well with the theoretical prediction, revealing that the direct band gap of Ge can be tuned in the range of 0.785 eV (1580 nm) to 0.658 eV (1885 nm). This work offers a pathway toward a strained Ge laser with low threshold current, as well as opens possibilities for new types of optoelectronics devices based on strain engineering.