The conventional on-chip spiral inductor consumes a significant top-metal routing area, thereby preventing its popularity in many on-chip applications. Recently through-silicon-via (TSV) based inductor (also known as TSV-inductor) with a magnetic core has been proved to be a viable option for the on-chip DC-DC converter. The operating conditions of these inductors play a major role in maximizing the performance and efficiency of the DC-DC converter. However, there is a critical need to study the design and optimization details of magnetic core TSV-inductors with the unique 3D structure embedding magnetic core. This paper aims to provide a clear understanding of the modeling details of a magnetic core TSV-inductor and a design and optimization methodology to assist efficient inductor design. Moreover, a machine learning assisted model combining physical details and artificial neural network (ANN) is also proposed to extract the equivalent circuit to further facilitate DC-DC converter design. Experimental results show that the optimized TSV-inductor with the magnetic core and air-gap can achieve inductance density improvement of up to 7.7 × and quality factor improvements of up to 1.6 × for the same footprint compared with the TSV-inductor without a magnetic core. For on-chip DC-DC converter applications, the converter efficiency can be improved by up to 15.9% and 6.8% compared with the conventional spiral and TSV-inductor without magnetic core, respectively.

Given the stringent requirements of energy efficiency for Internet-of-Things edge devices, approximate multipliers have recently received growing attention, especially in error-resilient applications. The computation error and energy efficiency largely depend on how and where the approximation is introduced into a design. Thus, this article aims to provide a comprehensive review of the approximation techniques in multiplier designs ranging from algorithms and architectures to circuits. We have implemented representative approximate multiplier designs in each category to understand the impact of the design techniques on accuracy and efficiency. The designs can then be effectively deployed in high level applications, such as machine learning, to gain energy efficiency at the cost of slight accuracy loss.CCS Concepts: • General and reference → Surveys and overviews; • Hardware → Arithmetic and datapath circuits; System-level fault tolerance.

No abstract

No abstract

Given the stringent requirements of energy efficiency for Internet-of-Things edge devices, approximate multipliers, as a basic component of many processors and accelerators, have been constantly proposed and studied for decades, especially in error-resilient applications. The computation error and energy efficiency largely depend on how and where the approximation is introduced into a design. Thus, this article aims to provide a comprehensive review of the approximation techniques in multiplier designs ranging from algorithms and architectures to circuits. We have implemented representative approximate multiplier designs in each category to understand the impact of the design techniques on accuracy and efficiency. The designs can then be effectively deployed in high-level applications, such as machine learning, to gain energy efficiency at the cost of slight accuracy loss.