In this study, we investigated the influence of frequency, film thickness, and SiO 2 content on the dielectric constant (K) and loss tangent (tan d) of liquid crystalline polyimide (LCPi) and liquid crystalline polyimide/SiO 2 (LCPi/SiO 2 ) nanocomposites in a high frequency environment. We tested the loss tangent of the LCPi and LCPi/SiO 2 nanocomposites within the high frequency 1 MHz to 3 GHz range, and determined its value to be between 0.01 and 0.001. In addition, we found a formant for frequencies ranging from 0.5 GHz to 1 GHz. We also inferred from the dielectric loss graphs of films with different thicknesses that the formants of the loss tangent shifted toward higher frequencies with increasing thicknesses. When measuring the dielectric constant at high frequencies, we found that the dielectric constant decreased markedly with increased SiO 2 contents. Using the dielectric constant of high-frequency circuit board materials as the standard, the dielectric constant of the LCPi/SiO 2 nanocomposites at the frequency range from 1 MHz to 3 GHz was found to be as high as 2.2-3.4, thereby confirming the viability of LCPi/ SiO 2 nanocomposites as candidate materials for high-frequency circuit board. In addition, the volume resistivity (q V ) of the LCPi and LCPi/SiO 2 nanocomposites also increased with increased SiO 2 contents.
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